Panpan Lin

1.8k total citations
106 papers, 1.4k citations indexed

About

Panpan Lin is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry. According to data from OpenAlex, Panpan Lin has authored 106 papers receiving a total of 1.4k indexed citations (citations by other indexed papers that have themselves been cited), including 48 papers in Electrical and Electronic Engineering, 46 papers in Mechanical Engineering and 45 papers in Materials Chemistry. Recurrent topics in Panpan Lin's work include Advanced ceramic materials synthesis (29 papers), Advanced materials and composites (21 papers) and Ferroelectric and Piezoelectric Materials (16 papers). Panpan Lin is often cited by papers focused on Advanced ceramic materials synthesis (29 papers), Advanced materials and composites (21 papers) and Ferroelectric and Piezoelectric Materials (16 papers). Panpan Lin collaborates with scholars based in China, United States and Japan. Panpan Lin's co-authors include Tiesong Lin, Peng He, Liqun Li, Jiandong Wang, Shi‐Qing Wang, Han Liu, Shiwang Cheng, Xiaoxiao Li, Jiming Wang and Ce Wang and has published in prestigious journals such as The Journal of Chemical Physics, Macromolecules and Chemical Engineering Journal.

In The Last Decade

Panpan Lin

98 papers receiving 1.4k citations

Peers

Countries citing papers authored by Panpan Lin

Since Specialization

Citations

This map shows the geographic impact of Panpan Lin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Panpan Lin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Panpan Lin more than expected).

Fields of papers citing papers by Panpan Lin

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Panpan Lin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Panpan Lin. The network helps show where Panpan Lin may publish in the future.

Co-authorship network of co-authors of Panpan Lin

This figure shows the co-authorship network connecting the top 25 collaborators of Panpan Lin. A scholar is included among the top collaborators of Panpan Lin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Panpan Lin. Panpan Lin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Work	Indexed citations
1	Designing high-strength and low-deformation diffusion-bonded 5A06 joints via spark plasma sintering and heat treatment 2025 ·Journal of Manufacturing Processes ·Tong Wu, Rui Xu, (unknown), Yuan Gao, Yongjun Li, Kun Fang, (unknown), Ce Wang, Panpan Lin, Tiesong Lin, Peng He	0
2	Weld morphology, microstructure and mechanical property of laser welded joint of Ti80 alloy 2025 ·Journal of Materials Research and Technology ·Fei Yan, (unknown), (unknown), Panpan Lin, Zhongmei Gao, Pan Zhang, (unknown), Peng Jiang	0
3	Interface micro-structure via ultrafast laser ablating in diamond/Cu joint to achieve high strength bonding and high efficiency heat conduction 2025 ·Journal of Manufacturing Processes ·(unknown), Panpan Lin, Yong Ding, (unknown), (unknown), (unknown), (unknown), Peng He, Tiesong Lin	1
4	Femtosecond laser-induced honeycomb structure on the interface for the micro-welding of YSZ/sapphire 2025 ·Journal of Advanced Ceramics ·(unknown), Xinyue Li, (unknown), (unknown), Rui Xu, (unknown), Yuwei Zhao, (unknown), Rui Pan, Panpan Lin, Tiesong Lin, Shujun Chen, Peng He	1
5	A new strategy for preparing high strength and high precision diffusion bonding GH536 joints via pulsed current and subsequent heat treatment 2024 ·Journal of Manufacturing Processes ·Tong Wu, Yuyuan Liu, (unknown), Ke Li, Rui Xu, (unknown), Ce Wang, Panpan Lin, Xin Yue, Tiesong Lin, Peng He	3
6	A new strategy for preparing high strength diffusion-bonded Ni-based superalloy joints at ultra-low temperature via surface nanocrystallization and spark plasma sintering 2024 ·Journal of Material Science and Technology ·Tong Wu, Ce Wang, Yuyuan Liu, (unknown), Panpan Lin, Xin Yue, Tiesong Lin, Peng He	3
7	Microstructure and properties of YIG/YIG magnetic homogenization joint fabricated by a novel Bi2O3–B2O3–NiO–Fe2O3 magnetic glass 2024 ·Ceramics International ·Haohua He, Ce Wang, (unknown), Panpan Lin, (unknown), (unknown), Yongkang Dong, Tiesong Lin, Peng He	1
8	Interfacial behaviors and mechanism of ZrC-SiC composite and Ti system under pulsed electric current 2023 ·Composites Part B Engineering ·Jincheng Lin, Xinyue Li, Ce Wang, Rui Xu, (unknown), (unknown), Panpan Lin, Han Mei, Yue Liu, (unknown), Peng He, Tiesong Lin	18
9	Reactions mechanism and mechanical properties of a SiCf/SiC joint affected by Cu/Ni/Ti elements and inhomogeneous composites 2023 ·Journal of the European Ceramic Society ·Jia Yang, (unknown), Tong Wu, (unknown), Haohua He, (unknown), Ce Wang, Panpan Lin, Peng He, Tiesong Lin, Han Mei, Yue Liu	6
10	Joining SiCf/SiC composites to Al0.3CoCrFeNi high-entropy alloys with a Cu–Ti filler alloy: Interfacial reactions, high-entropy effects, and mechanical properties 2023 ·Materials Science and Engineering A ·Jia Yang, (unknown), (unknown), (unknown), (unknown), Panpan Lin, Ce Wang, Peng He, Tiesong Lin, Han Mei, Yue Liu	13
11	First-principles calculations and Yb3+ doping effects study of garnet-type solid state electrolytes 2023 ·Solid State Ionics ·(unknown), Ce Wang, Zhan‐Guo Liu, Panpan Lin, Zhiyuan Wang, Jincheng Lin, (unknown), Peng He, Tiesong Lin, Xiaoming Duan	3
12	An efficient method to engage oxide ceramics in low-temperature interfacial reactions: Microstructure evolution and kinetics behaviors based on supercooling in a transient liquid phase bonding joint 2023 ·Journal of Material Science and Technology ·Jia Yang, (unknown), Panpan Lin, (unknown), (unknown), Tiesong Lin, Peng He, (unknown)	14
13	3D lithiophilic framework fixed on the surface of LLZTO solid electrolyte shaping the contact between Li metal and ceramic 2023 ·Chemical Engineering Journal ·Yuhao Shi, Yifei Cai, Jiaqi Zhao, Tong Wu, (unknown), Tiesong Lin, Panpan Lin, Ce Wang, Peng He	13
14	Microstructural engineering for Ta-doped Li-garnet solid electrolyte toward enhancing performance 2023 ·Energy storage materials ·(unknown), (unknown), Ce Wang, Zhan‐Guo Liu, Xin Yue, Xiaoming Duan, (unknown), Xinyue Li, (unknown), Panpan Lin, Tiesong Lin, Peng He	20
15	Interfacial reaction mechanisms of heat-resistant diamond/Cu joint synergistically achieved by active modified layer and NiTi particles assisted isothermal solidification 2023 ·Ceramics International ·(unknown), Panpan Lin, Jincheng Lin, Xinyue Li, (unknown), (unknown), (unknown), Ce Wang, Peng He, Tiesong Lin	1
16	The effect of heteroatoms at end groups of anthracene derivatives on the photoelectric properties and crystal/film morphology: a theoretical perspective 2023 ·Journal of Materials Chemistry C ·(unknown), Xiaoqi Sun, Panpan Lin, (unknown), Jing‐Fu Guo, (unknown), Jian‐Xun Fan, Hui Li, Luyi Zou, Ai‐Min Ren	2
17	Theoretical study of the tuning role of β-methylthio or β-methylselenyl on the charge-transport properties of acenedithiophenes derivatives 2023 ·Physical Chemistry Chemical Physics ·Huiyuan Li, (unknown), Panpan Lin, (unknown), Jian‐Xun Fan, (unknown), Hui Li, Luyi Zou, Jing‐Fu Guo, Ai‐Min Ren	3
18	A new method for preparing high-strength and thermally-resistant ceramic/metal brazed joint at low temperature 2022 ·Journal of Materials Research and Technology ·Jincheng Lin, Jiafeng Zhou, Di Yu, Jiaqi Zhao, (unknown), Tiesong Lin, Panpan Lin, Peng He	13
19	Unveiling the effects of substituents on the packing motif and the carrier transport of dinaphtho-thieno-thiophene (DNTT)-based materials 2021 ·New Journal of Chemistry ·Panpan Lin, (unknown), Jing‐Fu Guo, (unknown), Huiyuan Li, Luyi Zou, Ai‐Min Ren	2
20	Theoretical investigations on the charge transport properties of anthracene derivatives with aryl substituents at the 2,6-position—thermally stable “herringbone” stacking motifs 2021 ·Physical Chemistry Chemical Physics ·(unknown), (unknown), Panpan Lin, Jin Wang, Jian‐Xun Fan, Huiyuan Li, Ai‐Min Ren, Jing‐Fu Guo	10

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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