Nian Cai

424 total citations
21 papers, 328 citations indexed

About

Nian Cai is a scholar working on Electrical and Electronic Engineering, Industrial and Manufacturing Engineering and Computer Vision and Pattern Recognition. According to data from OpenAlex, Nian Cai has authored 21 papers receiving a total of 328 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 9 papers in Industrial and Manufacturing Engineering and 8 papers in Computer Vision and Pattern Recognition. Recurrent topics in Nian Cai's work include Industrial Vision Systems and Defect Detection (9 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers) and Image Processing Techniques and Applications (6 papers). Nian Cai is often cited by papers focused on Industrial Vision Systems and Defect Detection (9 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers) and Image Processing Techniques and Applications (6 papers). Nian Cai collaborates with scholars based in China and Singapore. Nian Cai's co-authors include Han Wang, Shaowei Weng, Xindu Chen, Feiyang Li, Bingo Wing‐Kuen Ling, Gen Liu, Jeng‐Shyang Pan, Yijun Liu, Zhijing Yang and Nannan Zhu and has published in prestigious journals such as Expert Systems with Applications, IEEE Transactions on Circuits and Systems for Video Technology and IEEE Transactions on Instrumentation and Measurement.

In The Last Decade

Nian Cai

19 papers receiving 307 citations

Peers

Nian Cai

IME

CVPR

EEE

Deepak V. Kulkarni United States

Shaopeng Hu Japan

Honggui Deng China

Weibo Huang China

Yin Guo China

Krystian Erwiński Poland

Martin Peterek Germany

Kui Luo China

Yanqiang Sun China

Xungao Zhong China

Deepak V. Kulkarni United States

Nian Cai

355 ×1.7

IME

73 ×0.5

CVPR

284 ×2.5

EEE

49 ×0.9

68 ×1.3

Citations per year, relative to Nian Cai Nian Cai (= 1×) peers Deepak V. Kulkarni

Countries citing papers authored by Nian Cai

Since Specialization

Citations

This map shows the geographic impact of Nian Cai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nian Cai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nian Cai more than expected).

Fields of papers citing papers by Nian Cai

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Nian Cai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nian Cai. The network helps show where Nian Cai may publish in the future.

Co-authorship network of co-authors of Nian Cai

This figure shows the co-authorship network connecting the top 25 collaborators of Nian Cai. A scholar is included among the top collaborators of Nian Cai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Nian Cai. Nian Cai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

Sang, H. S., et al.. (2025). Multihop Anchor-Free Network With Tolerance-Adjustable Measure for Infrared Tiny Target Detection. IEEE Transactions on Instrumentation and Measurement. 74. 1–11. 1 indexed citations

Cai, Nian, et al.. (2025). Multiscale Edge-Enhanced Deep Learning for Cable Connection Visual Inspection of Low-Voltage Switchgear. IEEE Transactions on Instrumentation and Measurement. 74. 1–12. 1 indexed citations

Cai, Nian, et al.. (2025). A Bimodal Large–Small Model Collaborative Network for Joint Prediction of State of Health and Remaining Useful Life of Lithium-Ion Batteries. IEEE Transactions on Instrumentation and Measurement. 74. 1–13.

Cai, Nian, et al.. (2024). Measurement Error Analysis and Compensation for Optical Encoders: A Review. IEEE Transactions on Instrumentation and Measurement. 73. 1–30. 7 indexed citations

Dong, Yongchao, et al.. (2024). An Absolute Displacement Sensor Based on SNAP Microresonator and Similarity Matching Method. IEEE Sensors Journal. 24(7). 9744–9754.

Cai, Nian, et al.. (2023). Adaptive Hybrid Framework for Multiscale Void Inspection of Chip Resistor Solder Joints. IEEE Transactions on Instrumentation and Measurement. 72. 1–12. 3 indexed citations

Cai, Nian, et al.. (2023). Error Compensation for Optical Encoder Based on Variational Mode Decomposition With a Coarse-to-Fine Selection Scheme. IEEE Transactions on Instrumentation and Measurement. 72. 1–10. 9 indexed citations

Chen, Wenjie, et al.. (2021). IC Solder Joints Inspection via an Optimized Statistical Modeling Method. IEEE Transactions on Components Packaging and Manufacturing Technology. 12(2). 341–348. 5 indexed citations

Chen, Wenjie, et al.. (2020). Automatic optical inspection system for IC solder joint based on local-to-global ensemble learning. Soldering and Surface Mount Technology. 33(2). 65–74. 4 indexed citations

10.

Cai, Nian, et al.. (2019). Automatic detonator code recognition via deep neural network. Expert Systems with Applications. 145. 113121–113121. 7 indexed citations

11.

Cai, Nian, et al.. (2018). An Effective Optimization Scheme for ECG Signal Denoising via Low-Rank Matrix Decomposition. Circuits Systems and Signal Processing. 38(1). 138–152. 2 indexed citations

12.

Hu, Feng, et al.. (2018). Error analysis and compensation of an optical linear encoder. IET Science Measurement & Technology. 12(4). 561–566. 16 indexed citations

13.

Cai, Nian, et al.. (2018). SMT Solder Joint Inspection via a Novel Cascaded Convolutional Neural Network. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(4). 670–677. 63 indexed citations

14.

Cai, Nian, et al.. (2018). IC Solder Joint Inspection Based on an Adaptive-Template Method. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(6). 1121–1127. 24 indexed citations

15.

Cai, Nian, et al.. (2017). IC Solder Joint Inspection via Robust Principle Component Analysis. IEEE Transactions on Components Packaging and Manufacturing Technology. 1–10. 38 indexed citations

16.

Weng, Shaowei, Yijun Liu, Jeng‐Shyang Pan, & Nian Cai. (2016). Reversible data hiding based on flexible block-partition and adaptive block-modification strategy. Journal of Visual Communication and Image Representation. 41. 185–199. 34 indexed citations

17.

Cai, Nian, et al.. (2016). IC solder joint inspection based on the Gaussian mixture model. Soldering and Surface Mount Technology. 28(4). 207–214. 22 indexed citations

18.

Cai, Nian, Nannan Zhu, Shaowei Weng, & Bingo Wing‐Kuen Ling. (2015). Difference angle quantization index modulation scheme for image watermarking. Signal Processing Image Communication. 34. 52–60. 16 indexed citations

19.

Cai, Nian, et al.. (2015). A New IC Solder Joint Inspection Method for an Automatic Optical Inspection System Based on an Improved Visual Background Extraction Algorithm. IEEE Transactions on Components Packaging and Manufacturing Technology. 6(1). 161–172. 58 indexed citations

20.

Weng, Shaowei, et al.. (2013). Invariability of Mean Value Based Reversible Watermarking. J. Inf. Hiding Multim. Signal Process.. 4. 90–98. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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