N. Hosoda

2.2k citations
74 papers · 1.8k indexed · h-index 20
Topics
3D IC and TSV technologies (21 papers)Electronic Packaging and Soldering Technologies (17 papers)Particle Accelerators and Free-Electron Lasers (14 papers)
Partner nations
JapanGermanyChina

In The Last Decade

N. Hosoda

62 papers receiving 1.7k citations

Peers

N. Hosoda
Comparison fields: 5 of 109
  • Electrical and Electronic Engineering 692
  • Mechanics of Materials 436
  • Biomedical Engineering 382
  • Atomic and Molecular Physics, and Optics 333
  • Biomaterials 288
Replace Steven W. Cranford with:
Steven W. Cranford United States
Alexander Kovalev Germany
Jiyu Sun China
Martin Rosenthal France
Junqiu Zhang China
Qiming Wang United States
Yonggang Jiang China
Sabine Hild Austria
Kathryn J. Wahl United States
Zhiwu Han China
N. Hosoda relative to Steven W. Cranford United States Steven W. Cranford's profile →
Citations per field
00.5×1.5×2.0×
Steven W. Cranford · 1×
Citations per year

Countries citing papers authored by N. Hosoda

Since Specialization
Citations

This map shows the geographic impact of N. Hosoda's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by N. Hosoda with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites N. Hosoda more than expected).

Fields of papers citing papers by N. Hosoda

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by N. Hosoda. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by N. Hosoda. The network helps show where N. Hosoda may publish in the future.

Co-authorship network of co-authors of N. Hosoda

This figure shows the co-authorship network connecting the top 25 collaborators of N. Hosoda. A scholar is included among the top collaborators of N. Hosoda based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with N. Hosoda. N. Hosoda is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
#WorkIndexed citations
1 1
2 8
3 13
4 4
5 31
6 18
7 0
8 63
9
Development of the optical timing and RF distribution system for XFEL/SPRING-8
3
10 187
11
BEAM POSITION MONITOR AT THE SCSS PROTOTYPE ACCELERATOR
6
12 3
13 77
14 1
15 76
16 1
17
A New Approach To Cu-cu Direct Bump Bonding
9
18
RF system for SPring-8 storage ring at the commissioning
0
19
Microassembly System for Integration of MEMS Using the Surface Activated Bonding Method
3
20 53

About N. Hosoda

N. Hosoda is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Surfaces, Coatings and Films, having authored 74 papers that have together received 1.8k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (21 papers), Electronic Packaging and Soldering Technologies (17 papers) and Particle Accelerators and Free-Electron Lasers (14 papers). The work is most often cited by research in Surfaces, Coatings and Films (251 citations), Biomaterials (288 citations) and Mechanics of Materials (436 citations). N. Hosoda has collaborated with scholars based in Japan, Germany and China. Frequent co-authors include Tadatomo Suga, Stanislav N. Gorb, Hideki Takagi, Ayae Sugawara‐Narutaki, Takashi Kato, Ryutaro Maeda, Andrei Peressadko, G. Hüber, Ralph Spolenak and B. N. J. Persson. Their work appears in journals such as Physical Review Letters, Advanced Materials and Applied Physics Letters.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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