Min Shang

1.0k total citations
58 papers, 769 citations indexed

About

Min Shang is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials. According to data from OpenAlex, Min Shang has authored 58 papers receiving a total of 769 indexed citations (citations by other indexed papers that have themselves been cited), including 20 papers in Electrical and Electronic Engineering, 11 papers in Mechanical Engineering and 8 papers in Mechanics of Materials. Recurrent topics in Min Shang's work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloy Microstructure Properties (5 papers). Min Shang is often cited by papers focused on Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloy Microstructure Properties (5 papers). Min Shang collaborates with scholars based in China, United Kingdom and Taiwan. Min Shang's co-authors include Ji Luo, Xiu Li, Hongwei Qin, Liansheng Chen, Ian D. Rotherham, Zhixiong Yang, Haoran Ma, Yongli Zhao, Hongwei Qin and Chong Dong and has published in prestigious journals such as Construction and Building Materials, Electrochimica Acta and Waste Management.

In The Last Decade

Min Shang

52 papers receiving 741 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Min Shang China 13 183 176 110 102 70 58 769
Bing Yu China 16 90 0.5× 84 0.5× 25 0.2× 37 0.4× 199 2.8× 52 796
Michael P. Peterson United States 21 94 0.5× 19 0.1× 93 0.8× 50 0.5× 84 1.2× 67 1.4k
Ruth E. Falconer United Kingdom 17 52 0.3× 111 0.6× 56 0.5× 26 0.3× 7 0.1× 57 954
Xiuqing Wang China 14 77 0.4× 29 0.2× 18 0.2× 91 0.9× 40 0.6× 69 755
Mo Zhou China 17 86 0.5× 49 0.3× 26 0.2× 47 0.5× 7 0.1× 66 774
Zhengfei Li China 21 32 0.2× 32 0.2× 88 0.8× 226 2.2× 16 0.2× 83 1.4k
Haoxuan Yu China 19 27 0.1× 47 0.3× 106 1.0× 85 0.8× 14 0.2× 59 891
Jing Ren China 19 223 1.2× 182 1.0× 126 1.1× 107 1.0× 21 0.3× 81 953

Countries citing papers authored by Min Shang

Since Specialization
Citations

This map shows the geographic impact of Min Shang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Min Shang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Min Shang more than expected).

Fields of papers citing papers by Min Shang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Min Shang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Min Shang. The network helps show where Min Shang may publish in the future.

Co-authorship network of co-authors of Min Shang

This figure shows the co-authorship network connecting the top 25 collaborators of Min Shang. A scholar is included among the top collaborators of Min Shang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Min Shang. Min Shang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Lü, Fan, et al.. (2025). In situ study of the effect of bias voltage on the electrochemical migration behavior of Sn58Bi solder alloy. Electrochimica Acta. 540. 147252–147252. 1 indexed citations
2.
Yan, Jianhua, et al.. (2025). Shear behavior and failure modes of rock-like specimens with parallel flaws. Theoretical and Applied Fracture Mechanics. 141. 105344–105344.
3.
4.
He, Daihua, Min Shang, Y. Cai, et al.. (2024). Shock consolidation and spallation in nanopowdered Mg: Contributed by deformation twinning and disordering. Journal of Material Science and Technology. 224. 105–124. 1 indexed citations
5.
Shang, Min, et al.. (2024). Ni and Ni–P substrates inhibit Bi phase segregation and IMC overgrowth during the soldering process of Sn–Bi solder. Materials Chemistry and Physics. 325. 129726–129726. 4 indexed citations
6.
Shang, Min, Xiangxu Chen, Yunpeng Wang, et al.. (2024). Diffusion Barrier Performance of Ni-W Layer at Sn/Cu Interfacial Reaction. Materials. 17(15). 3682–3682. 1 indexed citations
7.
Wang, Li, Shihao Guo, Xiaofu Li, et al.. (2024). First-Principles Study of Cu Addition on Mechanical Properties of Ni3Sn4-Based Intermetallic Compounds. Metals. 14(1). 64–64. 1 indexed citations
8.
Shang, Min, Xiangxu Chen, Jia-Hong Ke, et al.. (2024). IMC growth mechanism of Sn58Bi/Cu solder joints and its effect on the coarsening of the Bi phase. Journal of Materials Research and Technology. 33. 6307–6318. 7 indexed citations
9.
Guo, Shihao, Li Wang, Min Shang, et al.. (2024). First-principles study of Ni additions on mechanical properties of η'-Cu6Sn5-based intermetallic compound. Microelectronics Reliability. 162. 115514–115514. 1 indexed citations
10.
Shang, Min, Xiangxu Chen, Jing Xing, et al.. (2024). Thermal stability and diffusion barrier performance of amorphous Ni-P layer at Sn/Ni-P/Cu interface. Journal of Materials Science Materials in Electronics. 35(13). 3 indexed citations
11.
Han, Yunhui, Jiancheng Shu, Rong Wang, et al.. (2022). Toxic footprint and materials profile of electronic components in printed circuit boards. Waste Management. 141. 154–162. 12 indexed citations
12.
Shang, Min & Ji Luo. (2021). The Tapio Decoupling Principle and Key Strategies for Changing Factors of Chinese Urban Carbon Footprint Based on Cloud Computing. International Journal of Environmental Research and Public Health. 18(4). 2101–2101. 163 indexed citations
13.
Dong, Chong, Min Shang, Fei Chen, et al.. (2021). Investigation on growth of the orientation-preferred Cu6Sn5 on (001)Cu during the temperature-increased multiple reflow process. Journal of Alloys and Compounds. 885. 161205–161205. 8 indexed citations
14.
Shang, Min, et al.. (2019). PREDICTION OF CUMULATIVE DISPLACEMENT OF BAZIMEN LANDSLIDE BASED ON ONE-VARIABLE LINEAR REGRESSION MODEL. 工程地质学报. 27(5). 1172–1178. 1 indexed citations
15.
Li, Xiu, Min Shang, Hongwei Qin, & Liansheng Chen. (2015). Fast accurate fish detection and recognition of underwater images with Fast R-CNN. 1–5. 171 indexed citations
16.
Wang, Xiuqing, et al.. (2015). Application of Mobile Nursing Information System in High-quality Nursing. Advances in Social Science, Education and Humanities Research. 17.
17.
Shang, Min, et al.. (2014). The Status of RMB Financial Products of Commercial Banks in China: From the Perspective of Homogeneity. Cross-cultural communication. 10(6). 53–58. 1 indexed citations
18.
Shang, Min, et al.. (2010). Optimization of the properties of codoped single-domain Y–Ba–Cu–O bulk superconductors. Physica C Superconductivity. 470(11-12). 491–495. 5 indexed citations
19.
Shang, Min. (2009). Affecting Factors of Deformation of a Certain Landslide in the Three Gorges Reservoir Area. 2 indexed citations
20.
Shang, Min. (2009). Analysis of Principle and Defense of DDoS Attacks. Computer Technology and Development. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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