Meng H. Lean
Impact in
- Biomedical Engineering top 10%
- Microfluidic and Bio-sensing Technologies
- Microfluidic and Capillary Electrophoresis Applications
- Dielectric materials and actuators
- Advanced Sensor and Energy Harvesting Materials
-
- Electromagnetic Simulation and Numerical Methods
Papers in
-
- Electromagnetic Simulation and Numerical Methods 14
- Power Transformer Diagnostics and Insulation 5
- Electrohydrodynamics and Fluid Dynamics 4
-
- Numerical methods in engineering 10
- Co-authors
- Jeonggi SeoAnthony S. WexlerDan S. BloombergP. S. RameshQiming ZhangYash ThakurG. A. DomotoOsama A. Mohammed
- Journals
- IEEE Transactions on Magnetics (13 papers)Journal of Applied Physics (4 papers)IEEE Transactions on Dielectrics and Electrical Insulation (4 papers)International Journal for Numerical Methods in Engineering (3 papers)Applied Physics Letters (2 papers)
- Partner nations
- United StatesFranceCanada
In The Last Decade
Meng H. Lean
40 papers receiving 571 citations
Peers
Comparison fields: 5 of 63
- Biomedical Engineering 333
- Electrical and Electronic Engineering 289
- Mechanics of Materials 115
- Atomic and Molecular Physics, and Optics 132
- Electronic, Optical and Magnetic Materials 64
Countries citing papers authored by Meng H. Lean
This map shows the geographic impact of Meng H. Lean's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Meng H. Lean with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Meng H. Lean more than expected).
Fields of papers citing papers by Meng H. Lean
This network shows the impact of papers produced by Meng H. Lean. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Meng H. Lean. The network helps show where Meng H. Lean may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Meng H. Lean, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 0 | |
| 2 | 2015 | 2 | |
| 3 | 2014 | 5 | |
| 4 | 2007 | 65 | |
| 5 | 2007 | 112 | |
| 6 | 2005 | 0 | |
| 7 | 1999 | 1 | |
| 8 | 1998 | 9 | |
| 9 | 1994 | 2 | |
| 10 | 1992 | 5 | |
| 11 | 1991 | 17 | |
| 12 | 1990 | 4 | |
| 13 | 1990 | 6 | |
| 14 | 1987 | 4 | |
| 15 | 1987 | 5 | |
| 16 | 1985 | 25 | |
| 17 | 1985 | 3 | |
| 18 | 1984 | 24 | |
| 19 | 1983 | 2 | |
| 20 | Electromagnetic field solution with the boundary element method | 1981 | 13 |
About Meng H. Lean
Meng H. Lean is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Materials Chemistry, Atomic and Molecular Physics, and Optics and Biomedical Engineering, having authored 45 papers that have together received 638 indexed citations. Recurring topics across this work include High voltage insulation and dielectric phenomena (19 papers), Electromagnetic Simulation and Numerical Methods (14 papers), Dielectric materials and actuators (12 papers), Numerical methods in engineering (10 papers), Electromagnetic Scattering and Analysis (9 papers), Advanced Sensor and Energy Harvesting Materials (6 papers), Power Transformer Diagnostics and Insulation (5 papers) and Electrohydrodynamics and Fluid Dynamics (4 papers). The work is most often cited by research in Biomedical Engineering (333 citations), Electrical and Electronic Engineering (289 citations), Mechanics of Materials (115 citations), Atomic and Molecular Physics, and Optics (132 citations) and Electronic, Optical and Magnetic Materials (64 citations). Meng H. Lean has collaborated with scholars based in United States, France and Canada. Frequent co-authors include Jeonggi Seo, Anthony S. Wexler, Dan S. Bloomberg, P. S. Ramesh, Qiming Zhang, Yash Thakur, G. A. Domoto, Osama A. Mohammed, David A. Lowther and Philip L.‐F. Liu. Their work appears in journals such as IEEE Transactions on Magnetics, Journal of Applied Physics, IEEE Transactions on Dielectrics and Electrical Insulation, International Journal for Numerical Methods in Engineering and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.