Mei-Ling Wu
- Mechanics of Materials top 10%
- Mechanical Behavior of Composites 4
- Material Properties and Processing 4
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- Advanced Surface Polishing Techniques 5
- Acoustic Wave Phenomena Research 5
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- Electronic Packaging and Soldering Technologies 35
- 3D IC and TSV technologies 26
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- Metal Forming Simulation Techniques 9
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- Additive Manufacturing and 3D Printing Technologies 5
- Co-authors
- Lien-Wen ChenLiang-Yu WuWilliam D. SproulVinayak P. DravidYip-Wah ChungYip‐Wah ChungYusin LeeDung‐Ying Lin
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (7 papers)Microelectronics Reliability (3 papers)Smart Materials and Structures (2 papers)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Mei-Ling Wu
48 papers receiving 449 citations
Peers
Comparison fields: 5 of 63
- Mechanics of Materials 174
- Biomedical Engineering 155
- Electrical and Electronic Engineering 199
- Industrial and Manufacturing Engineering 28
- Mechanical Engineering 95
Countries citing papers authored by Mei-Ling Wu
This map shows the geographic impact of Mei-Ling Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mei-Ling Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mei-Ling Wu more than expected).
Fields of papers citing papers by Mei-Ling Wu
This network shows the impact of papers produced by Mei-Ling Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mei-Ling Wu. The network helps show where Mei-Ling Wu may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Mei-Ling Wu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 3 | |
| 3 | 2024 | 2 | |
| 4 | 2024 | 2 | |
| 5 | 2023 | 1 | |
| 6 | 2021 | 1 | |
| 7 | 2021 | 2 | |
| 8 | 2021 | 4 | |
| 9 | 2019 | 1 | |
| 10 | 2018 | 1 | |
| 11 | 2018 | 0 | |
| 12 | 2016 | 20 | |
| 13 | 2014 | 1 | |
| 14 | 2014 | 6 | |
| 15 | 2014 | 1 | |
| 16 | 2012 | 1 | |
| 17 | 2011 | 1 | |
| 18 | 2010 | 4 | |
| 19 | Pressure changes in spinal canal and evaluation of spinal cord injuries in spinal section subjected to impact. | 2001 | 4 |
| 20 | 1998 | 11 |
About Mei-Ling Wu
Mei-Ling Wu is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Mechanical Engineering, Statistics, Probability and Uncertainty and Automotive Engineering, having authored 55 papers that have together received 468 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (35 papers), 3D IC and TSV technologies (26 papers), Metal Forming Simulation Techniques (9 papers), Advanced Surface Polishing Techniques (5 papers), Acoustic Wave Phenomena Research (5 papers), Additive Manufacturing and 3D Printing Technologies (5 papers), Mechanical Behavior of Composites (4 papers) and Material Properties and Processing (4 papers). The work is most often cited by research in Mechanics of Materials (174 citations), Biomedical Engineering (155 citations), Electrical and Electronic Engineering (199 citations), Industrial and Manufacturing Engineering (28 citations) and Mechanical Engineering (95 citations). Mei-Ling Wu has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Lien-Wen Chen, Liang-Yu Wu, William D. Sproul, Vinayak P. Dravid, Yip-Wah Chung, Yip‐Wah Chung, Yusin Lee, Lien-Wen Chen, Dung‐Ying Lin and Donald E. Barker. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Microelectronics Reliability, Smart Materials and Structures, PeerJ and International Journal of Biological Macromolecules.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.