Mei-Ling Wu

595 total citations
55 papers, 468 citations indexed

About

Mei-Ling Wu is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering. According to data from OpenAlex, Mei-Ling Wu has authored 55 papers receiving a total of 468 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 17 papers in Mechanics of Materials and 17 papers in Mechanical Engineering. Recurrent topics in Mei-Ling Wu's work include Electronic Packaging and Soldering Technologies (35 papers), 3D IC and TSV technologies (26 papers) and Metal Forming Simulation Techniques (9 papers). Mei-Ling Wu is often cited by papers focused on Electronic Packaging and Soldering Technologies (35 papers), 3D IC and TSV technologies (26 papers) and Metal Forming Simulation Techniques (9 papers). Mei-Ling Wu collaborates with scholars based in Taiwan, United States and China. Mei-Ling Wu's co-authors include Lien-Wen Chen, Liang-Yu Wu, William D. Sproul, Yip-Wah Chung, Vinayak P. Dravid, Yip‐Wah Chung, Yusin Lee, Dung‐Ying Lin, Lien-Wen Chen and Donald E. Barker and has published in prestigious journals such as Materials Science and Engineering A, Journal of Physics Condensed Matter and International Journal of Biological Macromolecules.

In The Last Decade

Mei-Ling Wu

48 papers receiving 449 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Mei-Ling Wu Taiwan 11 199 174 155 95 92 55 468
Qingming Wang China 6 178 0.9× 67 0.4× 266 1.7× 151 1.6× 82 0.9× 26 487
Yunxian Cui China 12 118 0.6× 60 0.3× 168 1.1× 110 1.2× 84 0.9× 58 345
Abhijit Bhattacharyya United States 14 91 0.5× 127 0.7× 199 1.3× 165 1.7× 331 3.6× 49 659
Ming Ma China 14 178 0.9× 114 0.7× 260 1.7× 151 1.6× 311 3.4× 73 634
Yeh-Sun Hong South Korea 16 106 0.5× 67 0.4× 329 2.1× 282 3.0× 79 0.9× 38 605
Natarajan Shankar United States 12 130 0.7× 240 1.4× 327 2.1× 191 2.0× 203 2.2× 32 606
Fushi Bai Germany 11 134 0.7× 96 0.6× 126 0.8× 169 1.8× 135 1.5× 21 411
Jianke Du China 11 91 0.5× 177 1.0× 137 0.9× 84 0.9× 118 1.3× 28 382
Johnathan Goodsell United States 12 37 0.2× 242 1.4× 98 0.6× 100 1.1× 39 0.4× 25 549
Yupeng He China 12 99 0.5× 62 0.4× 253 1.6× 141 1.5× 48 0.5× 32 446

Countries citing papers authored by Mei-Ling Wu

Since Specialization
Citations

This map shows the geographic impact of Mei-Ling Wu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Mei-Ling Wu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Mei-Ling Wu more than expected).

Fields of papers citing papers by Mei-Ling Wu

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Mei-Ling Wu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Mei-Ling Wu. The network helps show where Mei-Ling Wu may publish in the future.

Co-authorship network of co-authors of Mei-Ling Wu

This figure shows the co-authorship network connecting the top 25 collaborators of Mei-Ling Wu. A scholar is included among the top collaborators of Mei-Ling Wu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Mei-Ling Wu. Mei-Ling Wu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Wu, Mei-Ling, et al.. (2025). Predictive Modeling and Optimization of Wafer Warpage in FOPoP Packaging Using Element Birth and Death Technique. IEEE Transactions on Components Packaging and Manufacturing Technology. 15(3). 454–462. 1 indexed citations
2.
Wu, Mei-Ling, et al.. (2025). Cross-linking oxidized rice straw and chitosan for preparing a fully bio-based adhesive with exceptional water-resistant bonding performance. International Journal of Biological Macromolecules. 315(Pt 1). 144416–144416. 3 indexed citations
3.
Wu, Mei-Ling, et al.. (2024). Advanced FOPoP technology in heterogeneous integration: Finite element analysis with element birth and death technique. Simulation Modelling Practice and Theory. 138. 103041–103041. 2 indexed citations
4.
Wu, Mei-Ling, et al.. (2023). A coupled finite element scheme to study the grinding force and warpage of silicon wafers during the backside grinding process. Journal of Mechanics. 39. 191–198. 1 indexed citations
5.
Wu, Mei-Ling, et al.. (2021). Prediction of Delamination Failure in Quad Flat No-Lead Packages Using Combined Experimental and Simulation Methods. IEEE Transactions on Components Packaging and Manufacturing Technology. 11(5). 785–792. 2 indexed citations
6.
7.
Wu, Mei-Ling, et al.. (2021). Simulation Study of the High-G Drop Impact Testing of Microelectronic Packaging Products. 751–755. 4 indexed citations
8.
Wu, Mei-Ling, et al.. (2019). Delamination and Cracking Effects in Quad Flat Package. 847–850. 1 indexed citations
9.
Wu, Mei-Ling, et al.. (2018). Empirical Equations for Optimization Conditions in Thermal Compression Bonding of Copper Pillar Flip Chip Packages. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(6). 1116–1120. 5 indexed citations
10.
11.
Lee, Yusin, et al.. (2016). Balance of efficiency and robustness in passenger railway timetables. Transportation Research Part B Methodological. 97. 142–156. 20 indexed citations
12.
13.
Wu, Mei-Ling, et al.. (2014). Simulation 3D TSV for stress-strain characteristics under mechanical and thermo-mechanical loading. 88. 234–237. 1 indexed citations
14.
Wang, Minghan & Mei-Ling Wu. (2014). Thermo-mechanical Stress of underfilled 3D IC packaging. 1 indexed citations
15.
Wang, Minghan & Mei-Ling Wu. (2012). Packaging of microelectronics for thermo-mechanical environments. 1–4. 1 indexed citations
16.
Wu, Mei-Ling. (2012). Assessing the impact of uncertainty in physics-of-Failure analysis of microelectronics damage. Materials Science and Engineering A. 558. 259–264. 2 indexed citations
17.
Wu, Liang-Yu, et al.. (2011). An Acoustic Metamaterial Bending Waveguide Design Using Transformation Acoustics. 937–943. 1 indexed citations
18.
Wu, Mei-Ling, et al.. (2010). Focusing analysis of a complex photonic crystal slab with negative refraction. Physica B Condensed Matter. 405(19). 4157–4162. 4 indexed citations
19.
Wu, Mei-Ling, et al.. (2001). Pressure changes in spinal canal and evaluation of spinal cord injuries in spinal section subjected to impact.. PubMed. 4(3). 175–9. 4 indexed citations
20.
Wu, Mei-Ling, et al.. (1998). Synthesis of Coatings With Hardness Exceeding 40 GPa by Magnetron Sputtering. Journal of Tribology. 120(2). 179–183. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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