Limeng Yin

1.3k total citations
52 papers, 1.0k citations indexed

About

Limeng Yin is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Aerospace Engineering. According to data from OpenAlex, Limeng Yin has authored 52 papers receiving a total of 1.0k indexed citations (citations by other indexed papers that have themselves been cited), including 43 papers in Mechanical Engineering, 26 papers in Electrical and Electronic Engineering and 8 papers in Aerospace Engineering. Recurrent topics in Limeng Yin's work include Electronic Packaging and Soldering Technologies (26 papers), Advanced Welding Techniques Analysis (21 papers) and 3D IC and TSV technologies (16 papers). Limeng Yin is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), Advanced Welding Techniques Analysis (21 papers) and 3D IC and TSV technologies (16 papers). Limeng Yin collaborates with scholars based in China, Hong Kong and Australia. Limeng Yin's co-authors include Timing Zhang, Jilin Xie, Shanlin Wang, Yuhua Chen, Yuhua Chen, Yuhua Chen, Litao Wang, Chunsheng Lu, Yanlin Jia and Hehe Zhang and has published in prestigious journals such as Chemical Physics Letters, Materials Science and Engineering A and Journal of Alloys and Compounds.

In The Last Decade

Limeng Yin

49 papers receiving 977 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Limeng Yin China 19 842 294 293 158 136 52 1.0k
Hoon‐Hwe Cho South Korea 18 724 0.9× 190 0.6× 243 0.8× 199 1.3× 119 0.9× 54 945
Jilin Xie China 15 657 0.8× 90 0.3× 254 0.9× 192 1.2× 94 0.7× 57 773
M. Mazar Atabaki United States 18 805 1.0× 112 0.4× 265 0.9× 168 1.1× 95 0.7× 34 925
Tingfeng Song Spain 19 662 0.8× 347 1.2× 584 2.0× 123 0.8× 76 0.6× 49 1.0k
Zhengfei Hu China 17 691 0.8× 120 0.4× 342 1.2× 123 0.8× 322 2.4× 67 924
Chengwu Yao China 19 1.2k 1.4× 105 0.4× 383 1.3× 394 2.5× 303 2.2× 42 1.3k
Zhen Lu China 16 783 0.9× 123 0.4× 496 1.7× 203 1.3× 357 2.6× 47 948
Shiyun Dong China 22 1.1k 1.3× 199 0.7× 264 0.9× 153 1.0× 260 1.9× 59 1.3k
Majid Abbasi South Korea 16 817 1.0× 88 0.3× 357 1.2× 266 1.7× 107 0.8× 27 957

Countries citing papers authored by Limeng Yin

Since Specialization
Citations

This map shows the geographic impact of Limeng Yin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Limeng Yin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Limeng Yin more than expected).

Fields of papers citing papers by Limeng Yin

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Limeng Yin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Limeng Yin. The network helps show where Limeng Yin may publish in the future.

Co-authorship network of co-authors of Limeng Yin

This figure shows the co-authorship network connecting the top 25 collaborators of Limeng Yin. A scholar is included among the top collaborators of Limeng Yin based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Limeng Yin. Limeng Yin is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, Yiwei, et al.. (2025). Effect of heat treatments on microstructure and corrosion resistance of laser-cladded Inconel 625 coatings. International Journal of Electrochemical Science. 20(11). 101200–101200.
2.
3.
Tu, Jiangping, Gang Liu, Timing Zhang, et al.. (2025). Microstructure evolution and mechanical properties of Al0.5CoCrFeNi high-entropy alloy fabricated by direct energy deposition. Journal of Alloys and Compounds. 1036. 181620–181620.
4.
Luo, Yanping, Limeng Yin, Peng Wang, et al.. (2025). Fabrication of superhydrophobic Cr/PTFE/TiO2 composite coating via one-step electrodeposition for enhanced buoyancy and anti-biofouling performances. Journal of environmental chemical engineering. 13(5). 118939–118939. 1 indexed citations
5.
Wang, Y.K., Yuhua Chen, Jilin Xie, et al.. (2023). Microstructure and mechanical properties of CrMnFeCoNi high entropy alloy/Al composite with different reinforcement content. Journal of Alloys and Compounds. 960. 170882–170882. 9 indexed citations
6.
Chai, Sensen, Qingwei Dai, Shiyu Zhong, et al.. (2023). Relationship between solidification path, microstructure evolution and solidification cracking behavior of Mg-Al-Ca alloy during TIG welding. Journal of Material Science and Technology. 182. 176–186. 16 indexed citations
7.
Zhang, Hehe, et al.. (2023). Formation mechanism for the interface between Cu and Sn formed by magnetic pulse welding. Materials Characterization. 208. 113609–113609. 6 indexed citations
8.
Zhang, Wentao, Yuhua Chen, Jilin Xie, et al.. (2023). Interfacial microstructure of Al/Ta dissimilar joints by magnetic pulse welding. Journal of Materials Research and Technology. 23. 4167–4172. 11 indexed citations
9.
Wang, Shanlin, Limeng Yin, Jiaming Ni, et al.. (2023). Oxidation behavior and intermetallic compound growth dynamics of SAC305/Cu solder joints under rapid thermal shock. Transactions of Nonferrous Metals Society of China. 33(10). 3054–3066. 18 indexed citations
10.
Chen, Yuhua, Hongwei Wang, Jilin Xie, et al.. (2022). Effect of Ti Content on the Microstructure and Properties of CoCrFeNiMnTix High Entropy Alloy. Entropy. 24(2). 241–241. 34 indexed citations
11.
Zhang, Long, Junfeng Li, Limeng Yin, et al.. (2022). Molecular dynamics simulation and experimental study of tin growth in SAC lead-free microsolder joints under thermo-mechanical-electrical coupling. Materials Today Communications. 33. 104301–104301. 71 indexed citations
12.
Xu, Mingfang, et al.. (2022). Effect of post-heat treatment on microstructure and mechanical properties of nickel-based superalloy fabricated by ultrasonic-assisted wire arc additive manufacturing. Materials Science and Engineering A. 863. 144548–144548. 28 indexed citations
13.
Zhang, Long, Junfeng Li, Limeng Yin, et al.. (2021). Molecular dynamics simulation of the interfacial evolution and whisker growth of copper-tin coating under electrothermal coupling. Computational Materials Science. 202. 110981–110981. 6 indexed citations
14.
Yin, Limeng, Zhongwen Zhang, Hehe Zhang, et al.. (2021). Interfacial microstructure evolution and properties of Sn-0.3Ag-0.7Cu–xSiC solder joints. Materials Science and Engineering A. 809. 140995–140995. 30 indexed citations
15.
Yin, Limeng, Zhongwen Zhang, Gang Wang, et al.. (2020). Effects of Graphene Nanosheets on the Wettability and Mechanical Properties of Sn-0.3Ag-0.7Cu Lead-Free Solder. Journal of Electronic Materials. 49(12). 7394–7399. 12 indexed citations
16.
Yin, Limeng, et al.. (2019). Prediction of weld formation in 5083 aluminum alloy by twin-wire CMT welding based on deep learning. Welding in the World. 63(4). 947–955. 19 indexed citations
17.
Wang, Gang, et al.. (2019). Quantitative Correlation between Thermal Cycling and the Microstructures of X100 Pipeline Steel Laser-Welded Joints. Materials. 13(1). 121–121. 13 indexed citations
18.
19.
Yin, Limeng, et al.. (2017). Tensile strength and interfacial reaction of Cu-cored SAC305 solder joint. 35. 513–515. 1 indexed citations
20.
Yin, Limeng, et al.. (2012). The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures. Journal of Materials Science Materials in Electronics. 24(4). 1369–1374. 21 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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