Kai Takeuchi

647 total citations
48 papers, 505 citations indexed

About

Kai Takeuchi is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Polymers and Plastics. According to data from OpenAlex, Kai Takeuchi has authored 48 papers receiving a total of 505 indexed citations (citations by other indexed papers that have themselves been cited), including 38 papers in Electrical and Electronic Engineering, 17 papers in Biomedical Engineering and 10 papers in Polymers and Plastics. Recurrent topics in Kai Takeuchi's work include 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (19 papers) and Synthesis and properties of polymers (10 papers). Kai Takeuchi is often cited by papers focused on 3D IC and TSV technologies (29 papers), Electronic Packaging and Soldering Technologies (19 papers) and Synthesis and properties of polymers (10 papers). Kai Takeuchi collaborates with scholars based in Japan, China and United States. Kai Takeuchi's co-authors include Beomjoon Kim, Tadatomo Suga, Nobuyuki Takama, Gábor A. Somorjai, Miquel Salmerón, Patrick Ruther, Oliver Paul, Masahisa Fujino, Fengwen Mu and Vincent Maurice and has published in prestigious journals such as Applied Physics Letters, Scientific Reports and Surface Science.

In The Last Decade

Kai Takeuchi

43 papers receiving 498 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Kai Takeuchi Japan 13 217 165 142 109 54 48 505
J. O'Brien Ireland 8 191 0.9× 192 1.2× 59 0.4× 40 0.4× 23 0.4× 15 383
Avishek Aiyar United States 10 359 1.7× 154 0.9× 58 0.4× 72 0.7× 28 0.5× 12 498
Bidhan Pramanick India 13 138 0.6× 222 1.3× 27 0.2× 132 1.2× 11 0.2× 43 428
Junye Tong China 11 194 0.9× 121 0.7× 41 0.3× 107 1.0× 5 0.1× 23 410
Amir H. Nashat United States 5 57 0.3× 243 1.5× 23 0.2× 53 0.5× 24 0.4× 6 397
Hyunhwan Lee South Korea 14 223 1.0× 221 1.3× 19 0.1× 266 2.4× 5 0.1× 19 530
Young‐Woo Lim South Korea 12 130 0.6× 266 1.6× 20 0.1× 173 1.6× 3 0.1× 16 485
Hung‐Chih Chang Taiwan 10 255 1.2× 168 1.0× 24 0.2× 248 2.3× 5 0.1× 28 512
Y. S. Papir United States 7 27 0.1× 92 0.6× 42 0.3× 144 1.3× 20 0.4× 9 432
John Garra United States 11 268 1.2× 353 2.1× 15 0.1× 289 2.7× 4 0.1× 14 694

Countries citing papers authored by Kai Takeuchi

Since Specialization
Citations

This map shows the geographic impact of Kai Takeuchi's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kai Takeuchi with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kai Takeuchi more than expected).

Fields of papers citing papers by Kai Takeuchi

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Kai Takeuchi. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kai Takeuchi. The network helps show where Kai Takeuchi may publish in the future.

Co-authorship network of co-authors of Kai Takeuchi

This figure shows the co-authorship network connecting the top 25 collaborators of Kai Takeuchi. A scholar is included among the top collaborators of Kai Takeuchi based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Kai Takeuchi. Kai Takeuchi is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Takeuchi, Kai & Eiji Higurashi. (2025). Room temperature wafer bonding via polysilazane for vacuum sealing bonding. Japanese Journal of Applied Physics. 64(3). 03SP36–03SP36.
2.
Takeuchi, Kai, et al.. (2025). Au hollow pyramidal bumps for low-temperature low-pressure bonding fabricated via Au film transfer method. Sensors and Actuators A Physical. 395. 116968–116968.
3.
Takeuchi, Kai, Takashi Matsumae, Hideki Takagi, et al.. (2025). Room temperature bonding of Au plating through surface smoothing using polyimide template stripping. Sensors and Actuators A Physical. 383. 116211–116211. 2 indexed citations
4.
Takeuchi, Kai, Tadatomo Suga, & Eiji Higurashi. (2024). Room temperature wafer bonding through conversion of polysilazane into $$\hbox {SiO}_{2}$$. Scientific Reports. 14(1). 1267–1267. 4 indexed citations
5.
Takeuchi, Kai, et al.. (2024). Formation of SiO2 Bonding Interface using Perhydropolysilazane at Room Temperature. 113–114. 1 indexed citations
6.
7.
Takeuchi, Kai, et al.. (2023). Room temperature bonding of Au assisted by self-assembled monolayer. Applied Physics Letters. 122(5). 4 indexed citations
8.
Takeuchi, Kai, Takashi Matsumae, Hideki Takagi, et al.. (2023). Template Stripping of Au from Polyimide Film for Smoothing of Bonding Surface. 133–134. 1 indexed citations
9.
Takeuchi, Kai & Tadatomo Suga. (2022). Quantification of wafer bond strength under controlled atmospheres. Japanese Journal of Applied Physics. 61(SF). SF1010–SF1010. 16 indexed citations
10.
Takeuchi, Kai, et al.. (2022). Removal of Adsorbed Water on Si Wafers for Surface Activated Bonding. 61–64. 3 indexed citations
11.
Takeuchi, Kai, et al.. (2021). Room Temperature Wafer Bonding of Glass Using Aluminum Oxide Intermediate Layer. Advanced Materials Interfaces. 8(5). 18 indexed citations
12.
Takeuchi, Kai, Nobuyuki Takama, Oliver Paul, et al.. (2021). Microfluidic chip connected to porous microneedle array for continuous ISF sampling. Drug Delivery and Translational Research. 12(2). 435–443. 39 indexed citations
13.
Takeuchi, Kai, Fengwen Mu, Akira Yamauchi, & Tadatomo Suga. (2021). Sequential Plasma Activation for Low Temperature Bonding of Aluminosilicate Glass. ECS Journal of Solid State Science and Technology. 10(5). 54007–54007. 11 indexed citations
14.
Takeuchi, Kai, et al.. (2020). Flexible and porous microneedles of PDMS for continuous glucose monitoring. Biomedical Microdevices. 22(4). 79–79. 51 indexed citations
15.
Takeuchi, Kai, et al.. (2019). Microfluidic chip to interface porous microneedles for ISF collection. Biomedical Microdevices. 21(1). 28–28. 68 indexed citations
16.
Takeuchi, Kai, et al.. (2018). Mechanism of bonding and debonding using surface activated bonding method with Si intermediate layer. Japanese Journal of Applied Physics. 57(4S). 04FC11–04FC11. 11 indexed citations
17.
Takeuchi, Kai, et al.. (2018). Room temperature bonding and debonding of polyimide film and glass substrate based on surface activate bonding method. Japanese Journal of Applied Physics. 57(2S1). 02BB05–02BB05. 6 indexed citations
18.
Takeuchi, Kai & Beomjoon Kim. (2018). Functionalized microneedles for continuous glucose monitoring. Nano Convergence. 5(1). 28–28. 42 indexed citations
19.
Takeuchi, Kai, Masahisa Fujino, Tadatomo Suga, M. Koizumi, & Takao Someya. (2015). Room temperature direct bonding and debonding of polymer film on glass wafer for fabrication of flexible electronic devices. 700–704. 3 indexed citations
20.
Tasaka, Akinori, et al.. (2014). Influence of chewing time on salivary stress markers. Journal of Prosthodontic Research. 58(1). 48–54. 17 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026