John A. Emerson

943 total citations
45 papers, 636 citations indexed

About

John A. Emerson is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials and Polymers and Plastics. According to data from OpenAlex, John A. Emerson has authored 45 papers receiving a total of 636 indexed citations (citations by other indexed papers that have themselves been cited), including 9 papers in Electrical and Electronic Engineering, 7 papers in Mechanics of Materials and 7 papers in Polymers and Plastics. Recurrent topics in John A. Emerson's work include Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Polymer Nanocomposites and Properties (5 papers). John A. Emerson is often cited by papers focused on Electronic Packaging and Soldering Technologies (7 papers), 3D IC and TSV technologies (5 papers) and Polymer Nanocomposites and Properties (5 papers). John A. Emerson collaborates with scholars based in United States and Malaysia. John A. Emerson's co-authors include Garth L. Wilkes, Jeffrey T. Koberstein, J. E. Sohn, Spiros H. Anastasiadis, Zohar Ophir, Andrew F. Siegel, Neville Reid Moody, Michelle L. Oyen, Betty Hackley and Robert F. Cook and has published in prestigious journals such as Journal of Applied Physics, Langmuir and Journal of Agricultural and Food Chemistry.

In The Last Decade

John A. Emerson

39 papers receiving 573 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
John A. Emerson United States 13 199 135 123 113 98 45 636
B. George France 17 140 0.7× 79 0.6× 168 1.4× 173 1.5× 19 0.2× 57 845
M. Shen United States 17 303 1.5× 102 0.8× 295 2.4× 60 0.5× 168 1.7× 40 967
R. Kuckuk Germany 10 111 0.6× 52 0.4× 207 1.7× 47 0.4× 57 0.6× 20 849
Thomas Wolf United States 18 63 0.3× 78 0.6× 116 0.9× 72 0.6× 60 0.6× 70 903
I. C. Watt Australia 17 442 2.2× 94 0.7× 83 0.7× 66 0.6× 40 0.4× 63 952
Bihai Song Germany 9 53 0.3× 56 0.4× 137 1.1× 95 0.8× 92 0.9× 10 442
В. Н. Стрельников Russia 13 110 0.6× 76 0.6× 206 1.7× 117 1.0× 156 1.6× 79 521
Jeffery R. Owens United States 15 86 0.4× 64 0.5× 134 1.1× 43 0.4× 165 1.7× 31 581
Zheng Wei China 18 422 2.1× 175 1.3× 250 2.0× 117 1.0× 39 0.4× 57 942
V. A. Val’tsifer Russia 14 54 0.3× 89 0.7× 213 1.7× 86 0.8× 163 1.7× 63 495

Countries citing papers authored by John A. Emerson

Since Specialization
Citations

This map shows the geographic impact of John A. Emerson's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by John A. Emerson with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites John A. Emerson more than expected).

Fields of papers citing papers by John A. Emerson

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by John A. Emerson. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by John A. Emerson. The network helps show where John A. Emerson may publish in the future.

Co-authorship network of co-authors of John A. Emerson

This figure shows the co-authorship network connecting the top 25 collaborators of John A. Emerson. A scholar is included among the top collaborators of John A. Emerson based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with John A. Emerson. John A. Emerson is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Noor, Ervina Efzan Mhd, et al.. (2018). A study on the effect of electromigration on solder alloy joint on copper with nickel surface finish. Soldering and Surface Mount Technology. 30(1). 26–34. 3 indexed citations
2.
Brooks, Carlton F., Anne Grillet, & John A. Emerson. (2006). Experimental Investigation of the Spontaneous Wetting of Polymers and Polymer Blends. Langmuir. 22(24). 9928–9941. 13 indexed citations
3.
Emerson, John A.. (2006). Thermal Management Concepts.. OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information).
4.
Oyen, Michelle L., Robert F. Cook, John A. Emerson, & Neville Reid Moody. (2004). Indentation responses of time-dependent films on stiff substrates. Journal of materials research/Pratt's guide to venture capital sources. 19(8). 2487–2497. 35 indexed citations
5.
Emerson, John A., et al.. (2004). SELF-ADHESION HYSTERESIS IN POLYDIMETHYLSILOXANE ELASTOMERS. The Journal of Adhesion. 80(1-2). 119–143. 10 indexed citations
6.
Emerson, John A., et al.. (2003). Techniques for determining the flow properties of underfill materials. 777–783. 2 indexed citations
7.
Woerdeman, Dara L., et al.. (2002). JKR contact mechanics for evaluating surface contamination on inorganic substrates. International Journal of Adhesion and Adhesives. 22(3). 257–264. 4 indexed citations
8.
Miragliotta, J., Richard C. Benson, Terry Phillips, & John A. Emerson. (2001). Simultaneous Measurements of Electrical Resistivity and Raman Scattering from Conductive Die Attach Adhesives. MRS Proceedings. 682. 3 indexed citations
9.
Moody, N. R., et al.. (2000). Interfacial Fracture of Thin Polymer Films on Aluminum. MRS Proceedings. 629(1). 3 indexed citations
10.
Emerson, John A., et al.. (2000). Evaluation of β-diketone-containing Polymeric Coupling Agents for Enhancing the Adhesion of Epoxy to Aluminum. The Journal of Adhesion. 72(3-4). 245–268. 1 indexed citations
11.
Emerson, John A., et al.. (2000). Coupling agent studies: reaction of thiol-containing esters with aluminum. International Journal of Adhesion and Adhesives. 20(6). 429–436. 4 indexed citations
12.
Miragliotta, J., Richard C. Benson, Terry Phillips, & John A. Emerson. (1998). Optical Probes and Electrical Resistivity Measurements of Conductive Die Attach Adhesives. MRS Proceedings. 515. 3 indexed citations
13.
Emerson, John A.. (1996). Yang Chu's Discovery of the Body. Philosophy East and West. 46(4). 533–533. 11 indexed citations
14.
Sohn, J. E., John A. Emerson, Patrick A. Thompson, & Jeffrey T. Koberstein. (1989). Rubber‐modified epoxies: Interfacial tension and morphology. Journal of Applied Polymer Science. 37(9). 2627–2636. 12 indexed citations
15.
Emerson, John A.. (1987). Rahdars and Their Tolls in Safavid and Afsharid Iran. Journal of the Economic and Social History of the Orient. 30(3). 318–318. 2 indexed citations
16.
Hackley, Betty, et al.. (1976). National marine fisheries service preliminary survey of selected seafoods for mercury, lead, cadmium, chromium, and arsenic content. Journal of Agricultural and Food Chemistry. 24(1). 47–53. 53 indexed citations
17.
Kenney, James T., et al.. (1973). Tin and iron hydrous oxide deposits on polyethylene, teflon, and paraffin. Journal of Colloid and Interface Science. 42(3). 589–596. 21 indexed citations
18.
Fontijn, Arthur, et al.. (1972). Tubular Fast Flow Reactor for High Temperature Gas Kinetic Studies. Review of Scientific Instruments. 43(5). 726–730. 17 indexed citations
19.
Emerson, John A., et al.. (1966). Effect of γ-Irradiation on the Microflora of Freshwater Fish. Applied Microbiology. 14(2). 261–266. 2 indexed citations
20.
Emerson, John A., A. M. Pearson, J. A. Hoefer, W. T. Magee, & L. J. Bratzler. (1964). Effect of Slaughter Weight upon the Processing Characteristics, Quality and Consumer Acceptability of Pork Carcasses and Cuts. Journal of Animal Science. 23(2). 436–443. 11 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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