Jiankui Chen

420 total citations
26 papers, 289 citations indexed

About

Jiankui Chen is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Mechanics of Materials. According to data from OpenAlex, Jiankui Chen has authored 26 papers receiving a total of 289 indexed citations (citations by other indexed papers that have themselves been cited), including 16 papers in Electrical and Electronic Engineering, 11 papers in Biomedical Engineering and 7 papers in Mechanics of Materials. Recurrent topics in Jiankui Chen's work include Electronic Packaging and Soldering Technologies (8 papers), Advanced Sensor and Energy Harvesting Materials (7 papers) and Adhesion, Friction, and Surface Interactions (6 papers). Jiankui Chen is often cited by papers focused on Electronic Packaging and Soldering Technologies (8 papers), Advanced Sensor and Energy Harvesting Materials (7 papers) and Adhesion, Friction, and Surface Interactions (6 papers). Jiankui Chen collaborates with scholars based in China. Jiankui Chen's co-authors include Zhouping Yin, YongAn Huang, Huimin Liu, Youlun Xiong, Hua Yang, Yiqun Li, Huimin Liu, Yong Huang, Hao Wu and Yongqing Duan and has published in prestigious journals such as Scientific Reports, Journal of Applied Mechanics and IEEE Transactions on Instrumentation and Measurement.

In The Last Decade

Jiankui Chen

23 papers receiving 278 citations

Peers

Jiankui Chen
Xavier F. Brun United States
Tongqun Ren China
Jufan Zhang China
Zhipeng Wu China
Yu–Hsi Huang Taiwan
Jae B. Kwak South Korea
F. Martínez Spain
Soonwan Chung South Korea
Xiaodong Wang China
Valentin Mateev Bulgaria
Xavier F. Brun United States
Jiankui Chen
Citations per year, relative to Jiankui Chen Jiankui Chen (= 1×) peers Xavier F. Brun

Countries citing papers authored by Jiankui Chen

Since Specialization
Citations

This map shows the geographic impact of Jiankui Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jiankui Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jiankui Chen more than expected).

Fields of papers citing papers by Jiankui Chen

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Jiankui Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jiankui Chen. The network helps show where Jiankui Chen may publish in the future.

Co-authorship network of co-authors of Jiankui Chen

This figure shows the co-authorship network connecting the top 25 collaborators of Jiankui Chen. A scholar is included among the top collaborators of Jiankui Chen based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Jiankui Chen. Jiankui Chen is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
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Chen, Jiankui, et al.. (2024). Multinozzle Droplet Volume Distribution Control in Inkjet Printing Based on Multiagent Soft Actor–Critic Network. IEEE/ASME Transactions on Mechatronics. 30(1). 447–457. 2 indexed citations
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Yang, Hua, et al.. (2023). Multiframe Super-Resolution With Dual Pyramid Multiattention Network for Droplet Measurement. IEEE Transactions on Instrumentation and Measurement. 72. 1–14. 4 indexed citations
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Chen, Jiankui, et al.. (2023). Prior Guided Multiscale Dynamic Deblurring Network for Diffraction Image Restoration in Droplet Measurement. IEEE Transactions on Instrumentation and Measurement. 73. 1–14. 2 indexed citations
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Chen, Jiankui, et al.. (2023). Planning method of droplet fusion scheduling based on mixed-integer programming. Science China Technological Sciences. 67(1). 157–171. 4 indexed citations
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Chen, Jiankui, et al.. (2022). Hybrid Safety Certificate for Fast Collision Checking in Sampling-Based Motion Planning. IEEE Robotics and Automation Letters. 8(1). 113–120. 4 indexed citations
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Chen, Jiankui, et al.. (2020). Active curved surface deforming of flexible conformal electronics by multi-fingered actuator. Robotics and Computer-Integrated Manufacturing. 64. 101942–101942. 16 indexed citations
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Chen, Jiankui, Xi Jiang, Wei Tang, et al.. (2019). Roll-to-roll stack and lamination of gas diffusion layer in multilayer structured membrane electrode assembly. Proceedings of the Institution of Mechanical Engineers Part B Journal of Engineering Manufacture. 234(1-2). 66–74. 12 indexed citations
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Huang, YongAn, et al.. (2018). Conformal Peeling of Device-on-Substrate System in Flexible Electronic Assembly. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(8). 1496–1506. 10 indexed citations
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Dong, Wentao, YongAn Huang, Zhouping Yin, Yuyu Zhou, & Jiankui Chen. (2018). Stretchable Tactile and Bio-potential Sensors for Human-Machine Interaction: A Review. Lecture notes in computer science. 155–163. 2 indexed citations
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Chen, Jiankui, et al.. (2017). High-Efficiency Revolving-Turret Chip Transferring Technology for Flip Chip Packaging. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(1). 154–164. 18 indexed citations
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Wan, Xiaodong, et al.. (2017). Theoretical and Experimental Studies of Competing Fracture for Flexible Chip-Adhesive-Substrate Composite Structure. IEEE Transactions on Components Packaging and Manufacturing Technology. 8(1). 57–64. 5 indexed citations
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Chen, Jiankui, Huimin Liu, YongAn Huang, & Zhouping Yin. (2016). High-rate roll-to-roll stack and lamination of multilayer structured membrane electrode assembly. Journal of Manufacturing Processes. 23. 175–182. 26 indexed citations
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Liu, Huimin, et al.. (2015). Competing Fracture of Thin-Chip Transferring From/Onto Prestrained Compliant Substrate. Journal of Applied Mechanics. 82(10). 14 indexed citations
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Huang, YongAn, et al.. (2014). Tunable Peeling Technique and Mechanism of Thin Chip From Compliant Adhesive Tapes. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(4). 560–568. 22 indexed citations
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Huang, Yong, et al.. (2014). Reliable Peeling of Ultrathin Die With Multineedle Ejector. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(9). 1545–1554. 22 indexed citations
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Huang, YongAn, Jiankui Chen, Zhouping Yin, & Youlun Xiong. (2011). Roll-to-Roll Processing of Flexible Heterogeneous Electronics With Low Interfacial Residual Stress. IEEE Transactions on Components Packaging and Manufacturing Technology. 1(9). 1368–1377. 29 indexed citations
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Chen, Jiankui, et al.. (2009). A hybrid control method of tension and position for a discontinuous web transport system. 265–270. 14 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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