J. T. C. Yeh

605 total citations
9 papers, 503 citations indexed

About

J. T. C. Yeh is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Computational Mechanics. According to data from OpenAlex, J. T. C. Yeh has authored 9 papers receiving a total of 503 indexed citations (citations by other indexed papers that have themselves been cited), including 5 papers in Mechanics of Materials, 5 papers in Electrical and Electronic Engineering and 4 papers in Computational Mechanics. Recurrent topics in J. T. C. Yeh's work include Copper Interconnects and Reliability (4 papers), Laser Material Processing Techniques (4 papers) and Metal and Thin Film Mechanics (3 papers). J. T. C. Yeh is often cited by papers focused on Copper Interconnects and Reliability (4 papers), Laser Material Processing Techniques (4 papers) and Metal and Thin Film Mechanics (3 papers). J. T. C. Yeh collaborates with scholars based in United States, Taiwan and Israel. J. T. C. Yeh's co-authors include G. Koren, W. M. Holber, J. S. Logan, J. B. O. Caughman, Dung-Ching Perng, Chuan Sun, Burn J. Lin and Seong-Ju Park and has published in prestigious journals such as Applied Physics Letters, Journal of Applied Physics and Journal of Vacuum Science & Technology A Vacuum Surfaces and Films.

In The Last Decade

J. T. C. Yeh

9 papers receiving 470 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
J. T. C. Yeh United States	8	238	203	200	157	100	9	503
A. I. Baise United States	7	213 0.9×	133 0.7×	107 0.5×	167 1.1×	112 1.1×	8	471
Matthias Bolle France	9	241 1.0×	72 0.4×	122 0.6×	98 0.6×	123 1.2×	12	369
Oskar Armbruster Austria	12	298 1.3×	258 1.3×	175 0.9×	98 0.6×	206 2.1×	17	643
Jean‐Michel Guay Canada	11	168 0.7×	206 1.0×	62 0.3×	75 0.5×	287 2.9×	22	629
Yun Cui China	13	218 0.9×	275 1.4×	80 0.4×	249 1.6×	215 2.1×	45	623
Lukas Urech Switzerland	11	139 0.6×	82 0.4×	160 0.8×	116 0.7×	146 1.5×	17	403
Andy C. van Popta Canada	10	146 0.6×	202 1.0×	85 0.4×	113 0.7×	137 1.4×	19	525
Yiling Lian China	11	131 0.6×	150 0.7×	75 0.4×	146 0.9×	164 1.6×	33	447
Inam Mirza Czechia	10	168 0.7×	206 1.0×	116 0.6×	292 1.9×	211 2.1×	24	588
Gustavo F. B. Almeida Brazil	11	137 0.6×	77 0.4×	43 0.2×	74 0.5×	142 1.4×	32	324

Countries citing papers authored by J. T. C. Yeh

Since Specialization

Citations

This map shows the geographic impact of J. T. C. Yeh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. T. C. Yeh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. T. C. Yeh more than expected).

Fields of papers citing papers by J. T. C. Yeh

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. T. C. Yeh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. T. C. Yeh. The network helps show where J. T. C. Yeh may publish in the future.

Co-authorship network of co-authors of J. T. C. Yeh

This figure shows the co-authorship network connecting the top 25 collaborators of J. T. C. Yeh. A scholar is included among the top collaborators of J. T. C. Yeh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. T. C. Yeh. J. T. C. Yeh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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9 of 9 papers shown

1.

Perng, Dung-Ching, et al.. (2009). Thermal and Electrical Properties of PVD Ru(P) Film as Cu Diffusion Barrier. Microelectronic Engineering. 87(3). 365–369. 25 indexed citations

2.

Holber, W. M., et al.. (1993). Copper deposition by electron cyclotron resonance plasma. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 11(6). 2903–2910. 71 indexed citations

3.

Yeh, J. T. C. & Burn J. Lin. (1988). <title>Chromium Mask Damage In Excimer Laser Projection Processing</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 922. 461–465. 4 indexed citations

4.

Yeh, J. T. C.. (1986). Laser ablation of polymers. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 4(3). 653–658. 148 indexed citations

5.

Park, Seong-Ju, et al.. (1986). Reactive Ion Etching of Molybdenum In CF₄/O₂ Plasma. MRS Proceedings. 68. 8 indexed citations

6.

Koren, G. & J. T. C. Yeh. (1984). Emission spectra, surface quality, and mechanism of excimer laser etching of polyimide films. Applied Physics Letters. 44(12). 1112–1114. 84 indexed citations

7.

Yeh, J. T. C., et al.. (1984). Magnetic field enhanced reactive ion etching of polyimide. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 2(3). 1292–1295. 7 indexed citations

8.

Koren, G. & J. T. C. Yeh. (1984). Emission spectra and etching of polymers and graphite irradiated by excimer lasers. Journal of Applied Physics. 56(7). 2120–2126. 126 indexed citations

9.

Yeh, J. T. C., et al.. (1983). Patterning of poly-para-xylylenes by reactive ion etching. Journal of Vacuum Science & Technology A Vacuum Surfaces and Films. 1(2). 604–608. 30 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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