J. Logan

456 total citations
9 papers, 293 citations indexed

About

J. Logan is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Atomic and Molecular Physics, and Optics. According to data from OpenAlex, J. Logan has authored 9 papers receiving a total of 293 indexed citations (citations by other indexed papers that have themselves been cited), including 7 papers in Electrical and Electronic Engineering, 5 papers in Biomedical Engineering and 3 papers in Atomic and Molecular Physics, and Optics. Recurrent topics in J. Logan's work include Advanced Surface Polishing Techniques (5 papers), Advanced MEMS and NEMS Technologies (4 papers) and 3D IC and TSV technologies (3 papers). J. Logan is often cited by papers focused on Advanced Surface Polishing Techniques (5 papers), Advanced MEMS and NEMS Technologies (4 papers) and 3D IC and TSV technologies (3 papers). J. Logan collaborates with scholars based in United States, United Kingdom and Czechia. J. Logan's co-authors include E.H. Klaassen, J.M. Noworolski, N.I. Maluf, K. Petersen, Joe Brown, G.T.A. Kovacs, C.W. Storment, S. Basavaiah, Chunhua Hu and A. W. Kleinsasser and has published in prestigious journals such as Applied Physics Letters, Sensors and Actuators A Physical and Solid-State Electronics.

In The Last Decade

J. Logan

9 papers receiving 260 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
J. Logan United States 5 204 128 115 74 19 9 293
S. Kolesov Germany 10 220 1.1× 84 0.7× 99 0.9× 144 1.9× 11 0.6× 30 317
H. Kasahara Japan 9 122 0.6× 32 0.3× 124 1.1× 108 1.5× 14 0.7× 41 248
A. Peczalski United States 13 404 2.0× 124 1.0× 48 0.4× 40 0.5× 6 0.3× 42 442
Christian Wipf Germany 14 456 2.2× 86 0.7× 172 1.5× 70 0.9× 12 0.6× 43 519
S. Yamaguchi Japan 10 206 1.0× 88 0.7× 118 1.0× 122 1.6× 20 1.1× 46 325
Eduard Rocas Spain 10 200 1.0× 75 0.6× 202 1.8× 37 0.5× 46 2.4× 27 304
Daniel Hagedorn Germany 9 96 0.5× 73 0.6× 32 0.3× 100 1.4× 21 1.1× 28 195
M. Glenn United States 9 338 1.7× 194 1.5× 138 1.2× 16 0.2× 20 1.1× 18 369
C. Bozada United States 10 343 1.7× 233 1.8× 48 0.4× 71 1.0× 6 0.3× 38 403
P. Pang United States 8 193 0.9× 102 0.8× 144 1.3× 211 2.9× 9 0.5× 16 347

Countries citing papers authored by J. Logan

Since Specialization
Citations

This map shows the geographic impact of J. Logan's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by J. Logan with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites J. Logan more than expected).

Fields of papers citing papers by J. Logan

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by J. Logan. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by J. Logan. The network helps show where J. Logan may publish in the future.

Co-authorship network of co-authors of J. Logan

This figure shows the co-authorship network connecting the top 25 collaborators of J. Logan. A scholar is included among the top collaborators of J. Logan based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with J. Logan. J. Logan is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

9 of 9 papers shown
1.
Noworolski, J.M., E.H. Klaassen, J. Logan, K. Petersen, & N.I. Maluf. (2005). Fabrication Of SOI Wafers With Buried Cavities Using Silicon Fusion Bonding And Electrochemical Etchback. Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95. 1. 71–74. 3 indexed citations
2.
Klaassen, E.H., K. Petersen, J.M. Noworolski, et al.. (2005). Silicon Fusion Bonding and Deep Reactive Ion Etching a New Technology for Microstructures. Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95. 1. 556–559. 12 indexed citations
3.
Noworolski, J.M., E.H. Klaassen, J. Logan, K. Petersen, & N.I. Maluf. (1996). Process for in-plane and out-of-plane single-crystal-silicon thermal microactuators. Sensors and Actuators A Physical. 55(1). 65–69. 32 indexed citations
4.
Noworolski, J.M., E.H. Klaassen, J. Logan, K. Petersen, & N.I. Maluf. (1996). Fabrication of SOI wafers with buried cavities using silicon fusion bonding and electrochemical etchback. Sensors and Actuators A Physical. 54(1-3). 709–713. 13 indexed citations
5.
Klaassen, E.H., K. Petersen, J.M. Noworolski, et al.. (1996). Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures. Sensors and Actuators A Physical. 52(1-3). 132–139. 141 indexed citations
6.
Ketchen, M. B., D.J. Pearson, A. W. Kleinsasser, et al.. (1991). Sub-μm, planarized, Nb-AlOx-Nb Josephson process for 125 mm wafers developed in partnership with Si technology. Applied Physics Letters. 59(20). 2609–2611. 87 indexed citations
7.
Evans, A G R, et al.. (1991). The Nature of Electrically Inactive Implanted Arsenic in Silicon after Rapid Thermal Annealing. MRS Proceedings. 224. 1 indexed citations
8.
Evans, A G R, et al.. (1990). High temperature millisecond annealing of arsenic implanted silicon. Solid-State Electronics. 33(6). 659–664. 3 indexed citations
9.
Logan, J., P. S. Dobson, Chris Hill, & Peter J. G. Pearson. (1988). Recrystallisation of amorphous silicon films by rapid isothermal and transient annealing. Semiconductor Science and Technology. 3(5). 437–441. 1 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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