I‐Ting Wang

1.6k citations

44 papers · 1.3k indexed · h-index 17

Impact in

Cellular and Molecular Neuroscience top 5%
- Neuroscience and Neural Engineering
- Photoreceptor and optogenetics research
Electrical and Electronic Engineering top 5%
- Advanced Memory and Neural Computing
- Ferroelectric and Negative Capacitance Devices
- Semiconductor materials and devices

Papers in ⓘ

Electrical and Electronic Engineering 37
- Ferroelectric and Negative Capacitance Devices 28
- Advanced Memory and Neural Computing 28
- Semiconductor materials and devices 15
- 3D IC and TSV technologies 3
- Thin-Film Transistor Technologies 3
Cellular and Molecular Neuroscience 12
- Neuroscience and Neural Engineering 10

Co-authors: Tuo‐Hung Hou (32 shared papers)Yufen Wang (3 shared papers)Chung-Wei Hsu (7 shared papers)Chih-Cheng Chang (5 shared papers)Jae-sun Seo (2 shared papers)Sarma Vrudhula (2 shared papers)Yu Cao (2 shared papers)Shimeng Yu (2 shared papers)
Journals: IEEE Transactions on Electron Devices (5 papers)Nanotechnology (3 papers)Scientific Reports (2 papers)IEEE Electron Device Letters (2 papers)Applied Physics Letters (1 paper)
Partner nations: Taiwan Singapore United States

In The Last Decade

I‐Ting Wang

41 papers receiving 1.3k citations

Peers

Countries citing papers authored by I‐Ting Wang

Since Specialization

Citations

This map shows the geographic impact of I‐Ting Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by I‐Ting Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites I‐Ting Wang more than expected).

Fields of papers citing papers by I‐Ting Wang

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by I‐Ting Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by I‐Ting Wang. The network helps show where I‐Ting Wang may publish in the future.

Co-authors

The 25 scholars most cited alongside I‐Ting Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with I‐Ting Wang Line = papers co-authored together I‐Ting Wang links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 44 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Mitigating effects of non-ideal synaptic device characteristics for on-chip learning Pai-Yu Chen, Binbin Lin, I‐Ting Wang, Tuo‐Hung Hou, Jieping Ye, Sarma Vrudhula, Jae-sun Seo, Yu Cao, Shimeng Yu	2015	175
2	3D Ta/TaO_x/TiO₂/Ti synaptic array and linearity tuning of weight update for hardware neural network applications Nanotechnology ·I‐Ting Wang, Chih-Cheng Chang, Li-Wen Chiu, Teyuh Chou, Tuo‐Hung Hou	2016	165
3	Characterization and Modeling of Nonfilamentary Ta/TaOx/TiO2/Ti Analog Synaptic Device Scientific Reports ·Yufen Wang, Yen-Chuan Lin, I‐Ting Wang, Tzu‐Ping Lin, Tuo‐Hung Hou	2015	160
4	Fully parallel write/read in resistive synaptic array for accelerating on-chip learning Nanotechnology ·Ligang Gao, I‐Ting Wang, Pai-Yu Chen, Sarma Vrudhula, Jae-sun Seo, Yu Cao, Tuo‐Hung Hou, Shimeng Yu	2015	115
5	Self-rectifying bipolar TaO x /TiO 2 RRAM with superior endurance over 10 12 cycles for 3D high-density storage-class memory Symposium on VLSI Technology ·Chung-Wei Hsu, I‐Ting Wang, Chun‐Li Lo, Ming-Chung Chiang, Wen-Yueh Jang, Chen-Hsi Lin, Tuo‐Hung Hou	2013	85
6	3D synaptic architecture with ultralow sub-10 fJ energy per spike for neuromorphic computation I‐Ting Wang, Yen-Chuan Lin, Yufen Wang, Chung-Wei Hsu, Tuo‐Hung Hou	2014	80
7	Homogeneous barrier modulation of TaO_x/TiO₂ bilayers for ultra-high endurance three-dimensional storage-class memory Nanotechnology ·Chung-Wei Hsu, Yufen Wang, Chia-Chen Wan, I‐Ting Wang, C.T. Chou, Wei-Li Lai, Yao‐Jen Lee, Tuo‐Hung Hou	2014	73
8	3D resistive RAM cell design for high-density storage class memory—a review Science China Information Sciences ·Boris Hudec, Chung-Wei Hsu, I‐Ting Wang, Wei-Li Lai, Che‐Chia Chang, Taifang Wang, K. Fröhlich, ChiaHua Ho, Chen-Hsi Lin, Tuo‐Hung Hou	2016	47
9	Progress and Benchmark of Spiking Neuron Devices and Circuits SHILAP Revista de lepidopterología ·Fu-Xiang Liang, I‐Ting Wang, Tuo‐Hung Hou	2021	45
10	Spectral imaging and spectral LIDAR systems: moving toward compact nanophotonics‐based sensing Nanophotonics ·Nanxi Li, Chong Pei Ho, I‐Ting Wang, Prakash Pitchappa, Yuan Hsing Fu, Yao Zhu, Lennon Y. T. Lee	2021	37
11	Bipolar ${\rm Ni}/{\rm TiO}_{2}/{\rm HfO}_{2}/{\rm Ni}$ RRAM With Multilevel States and Self-Rectifying Characteristics IEEE Electron Device Letters ·Chung-Wei Hsu, Tuo‐Hung Hou, Mei‐Chin Chen, I‐Ting Wang, Chun‐Li Lo	2013	36
12	Analog switching characteristics in TiW/Al2O3/Ta2O5/Ta RRAM devices Applied Physics Letters ·Wen‐Dong Song, Weijie Wang, Hock Koon Lee, Minghua Li, Victor Yi-Qian Zhuo, Zhixian Chen, King Jien Chui, Jen-Chieh Liu, I‐Ting Wang, Yao Zhu, Navab Singh	2019	33
13	Challenges and opportunities toward online training acceleration using RRAM-based hardware neural network Chih-Cheng Chang, Jen‐Chieh Liu, Yulin Shen, Teyuh Chou, Pin-Chun Chen, I‐Ting Wang, Chih-Chun Su, Minghong Wu, Boris Hudec, Che‐Chia Chang, Chia-Ming Tsai, Tian‐Sheuan Chang, H.‐S. Philip Wong, Tuo‐Hung Hou	2017	29
14	Giant Photoresponsivity and External Quantum Efficiency in a Contact‐Engineered Broadband a‐IGZO Phototransistor Advanced Functional Materials ·Yi‐Hsui Lai, I‐Ting Wang, Tuo‐Hung Hou	2022	27
15	Interface engineered HfO₂-based 3D vertical ReRAM Journal of Physics D Applied Physics ·Boris Hudec, I‐Ting Wang, Wei-Li Lai, Che‐Chia Chang, Peter Jančovič, K. Fröhlich, Matej Mičušík, Mária Omastová, Tuo‐Hung Hou	2016	24
16	3D vertical TaO<inf>x</inf>/TiO<inf>2</inf> RRAM with over 10<sup>3</sup> self-rectifying ratio and sub-μA operating current Chung-Wei Hsu, Chia-Chen Wan, I‐Ting Wang, Mei‐Chin Chen, Chun‐Li Lo, Yao‐Jen Lee, Wen-Yueh Jang, Chen-Hsi Lin, Tuo‐Hung Hou	2013	21
17	Flexible Three-Bit-Per-Cell Resistive Switching Memory Using a-IGZO TFTs IEEE Electron Device Letters ·Shih-Chieh Wu, Hsien-Tsung Feng, Ming‐Jiue Yu, I‐Ting Wang, Tuo‐Hung Hou	2013	16
18	Categorization of Multilevel-Cell Storage-Class Memory: An RRAM Example IEEE Transactions on Electron Devices ·Jen-Chieh Liu, Chung-Wei Hsu, I‐Ting Wang, Tuo‐Hung Hou	2015	16
19	In-Memory Annealing Unit (IMAU): Energy-Efficient (2000 TOPS/W) Combinatorial Optimizer for Solving Travelling Salesman Problem 2021 IEEE International Electron Devices Meeting (IEDM) ·Ming‐Chun Hong, Le-Chih Cho, Chih-Sheng Lin, Yu-Hui Lin, Po‐An Chen, I‐Ting Wang, Pei-Jer Tzeng, Shyh-Shyuan Sheu, Wei‐Chung Lo, Chih‐I Wu, Tuo‐Hung Hou	2021	13
20	Performance Enhancement and Transient Current Response of Ferroelectric Tunnel Junction: A Theoretical Study IEEE Transactions on Electron Devices ·Hsin‐Hui Huang, Yueh-Hua Chu, Tzu-Yun Wu, Ming-Hung Wu, I‐Ting Wang, Tuo‐Hung Hou	2022	12

About I‐Ting Wang

I‐Ting Wang is a scholar working on Electrical and Electronic Engineering, Cellular and Molecular Neuroscience, Materials Chemistry, Artificial Intelligence and Polymers and Plastics, having authored 44 papers that have together received 1.3k indexed citations. Recurring topics across this work include Ferroelectric and Negative Capacitance Devices (28 papers), Advanced Memory and Neural Computing (28 papers), Semiconductor materials and devices (15 papers), Neuroscience and Neural Engineering (10 papers), Transition Metal Oxide Nanomaterials (3 papers), 3D IC and TSV technologies (3 papers), Thin-Film Transistor Technologies (3 papers) and MXene and MAX Phase Materials (3 papers). The work is most often cited by research in Cellular and Molecular Neuroscience (497 citations), Electrical and Electronic Engineering (1.2k citations), Polymers and Plastics (172 citations), Cognitive Neuroscience (109 citations) and Artificial Intelligence (160 citations). I‐Ting Wang has collaborated with scholars based in Taiwan, Singapore and United States. Frequent co-authors include Tuo‐Hung Hou, Yufen Wang, Chung-Wei Hsu, Chih-Cheng Chang, Jae-sun Seo, Sarma Vrudhula, Yu Cao, Shimeng Yu, Pai-Yu Chen and Chun‐Li Lo. Their work appears in journals such as IEEE Transactions on Electron Devices, Nanotechnology, Scientific Reports, IEEE Electron Device Letters and Applied Physics Letters.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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