Hwa-Teng Lee
- Mechanical Engineering top 5%
- Electrical and Electronic Engineering top 10%
- Biomedical Engineering
- Mechanics of Materials
- Aerospace Engineering
- Co-authors
- Ming‐Hung ChenFu-Chuan HsuPo‐Wei ChenEdward W. HsuJoachim MayerAlexander SchwedtJialin WuChing‐Hwei Chue
- Topics
- Electronic Packaging and Soldering Technologies (11 papers)3D IC and TSV technologies (6 papers)Advanced Welding Techniques Analysis (6 papers)
In The Last Decade
Hwa-Teng Lee
21 papers receiving 701 citations
Peers
Comparison fields: 5 of 30
- Mechanical Engineering 624
- Electrical and Electronic Engineering 565
- Biomedical Engineering 135
- Mechanics of Materials 89
- Aerospace Engineering 87
Countries citing papers authored by Hwa-Teng Lee
This map shows the geographic impact of Hwa-Teng Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hwa-Teng Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hwa-Teng Lee more than expected).
Fields of papers citing papers by Hwa-Teng Lee
This network shows the impact of papers produced by Hwa-Teng Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hwa-Teng Lee. The network helps show where Hwa-Teng Lee may publish in the future.
Co-authorship network of co-authors of Hwa-Teng Lee
This figure shows the co-authorship network connecting the top 25 collaborators of Hwa-Teng Lee. A scholar is included among the top collaborators of Hwa-Teng Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hwa-Teng Lee. Hwa-Teng Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 1 | |
| 3 | 34 | |
| 4 | 7 | |
| 5 | 11 | |
| 6 | 1 | |
| 7 | 4 | |
| 8 | 7 | |
| 9 | 8 | |
| 10 | 35 | |
| 11 | 3 | |
| 12 | The influence of working parameters and size effect on surface roughness during EDM process | 2 |
| 13 | 74 | |
| 14 | 98 | |
| 15 | 7 | |
| 16 | 115 | |
| 17 | 2 | |
| 18 | 208 | |
| 19 | 10 | |
| 20 | 77 |
About Hwa-Teng Lee
Hwa-Teng Lee is a scholar working on Metals and Alloys, Mechanical Engineering and Electrical and Electronic Engineering, having authored 21 papers that have together received 737 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (6 papers). The work is most often cited by research in Metals and Alloys (58 citations), Mechanical Engineering (624 citations) and Electrical and Electronic Engineering (565 citations). Hwa-Teng Lee has collaborated with scholars based in Taiwan and Germany. Frequent co-authors include Ming‐Hung Chen, Fu-Chuan Hsu, Po‐Wei Chen, Edward W. Hsu, Joachim Mayer, Alexander Schwedt, Jialin Wu, Ching‐Hwei Chue, Hsiao‐Wei Chen and Yuan‐Chih Chang. Their work appears in journals such as Materials Science and Engineering A, Journal of Materials Processing Technology and Composite Structures.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.