Hwa-Teng Lee
- Metals and Alloys top 5%
- Mechanical Engineering top 5%
- Advanced Welding Techniques Analysis 6
- Advanced machining processes and optimization 5
- Intermetallics and Advanced Alloy Properties 5
- Welding Techniques and Residual Stresses 2
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- Electronic Packaging and Soldering Technologies 11
- 3D IC and TSV technologies 6
- Advanced Machining and Optimization Techniques 4
- General Materials Science top 10%
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- Advanced Surface Polishing Techniques 4
Hwa-Teng Lee
21 papers receiving 701 citations
Peers
Comparison fields: 5 of 30
- Metals and Alloys 58
- Mechanical Engineering 624
- Electrical and Electronic Engineering 565
- General Materials Science 19
- Mechanics of Materials 89
Countries citing papers authored by Hwa-Teng Lee
This map shows the geographic impact of Hwa-Teng Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hwa-Teng Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hwa-Teng Lee more than expected).
Fields of papers citing papers by Hwa-Teng Lee
This network shows the impact of papers produced by Hwa-Teng Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hwa-Teng Lee. The network helps show where Hwa-Teng Lee may publish in the future.
Co-authorship network
The 13 scholars most cited alongside Hwa-Teng Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2023 | 1 | |
| 2 | 2020 | 1 | |
| 3 | 2012 | 34 | |
| 4 | 2011 | 7 | |
| 5 | 2010 | 11 | |
| 6 | 2009 | 1 | |
| 7 | 2009 | 4 | |
| 8 | 2009 | 7 | |
| 9 | 2009 | 8 | |
| 10 | 2008 | 35 | |
| 11 | 2008 | 3 | |
| 12 | The influence of working parameters and size effect on surface roughness during EDM process | 2007 | 2 |
| 13 | 2006 | 74 | |
| 14 | 2005 | 98 | |
| 15 | 2003 | 7 | |
| 16 | 2003 | 115 | |
| 17 | 2003 | 2 | |
| 18 | 2003 | 208 | |
| 19 | 2002 | 10 | |
| 20 | 2002 | 77 |
About Hwa-Teng Lee
Hwa-Teng Lee is a scholar working on Metals and Alloys, Mechanical Engineering and Electrical and Electronic Engineering, having authored 21 papers that have together received 737 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (6 papers), Advanced Welding Techniques Analysis (6 papers), Advanced machining processes and optimization (5 papers), Intermetallics and Advanced Alloy Properties (5 papers), Advanced Surface Polishing Techniques (4 papers), Advanced Machining and Optimization Techniques (4 papers) and Welding Techniques and Residual Stresses (2 papers). The work is most often cited by research in Metals and Alloys (58 citations), Mechanical Engineering (624 citations) and Electrical and Electronic Engineering (565 citations). Hwa-Teng Lee has collaborated with scholars based in Taiwan and Germany. Frequent co-authors include Ming‐Hung Chen, Fu-Chuan Hsu, Po‐Wei Chen, Edward W. Hsu, Joachim Mayer, Alexander Schwedt, Jialin Wu, Ching‐Hwei Chue, Hsiao‐Wei Chen and Yuan‐Chih Chang. Their work appears in journals such as Materials Science and Engineering A, Journal of Materials Processing Technology and Composite Structures.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.