Hwa-Teng Lee

859 total citations
21 papers, 737 citations indexed

About

Hwa-Teng Lee is a scholar working on Mechanical Engineering, Electrical and Electronic Engineering and Biomedical Engineering. According to data from OpenAlex, Hwa-Teng Lee has authored 21 papers receiving a total of 737 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Mechanical Engineering, 16 papers in Electrical and Electronic Engineering and 4 papers in Biomedical Engineering. Recurrent topics in Hwa-Teng Lee's work include Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (6 papers). Hwa-Teng Lee is often cited by papers focused on Electronic Packaging and Soldering Technologies (11 papers), 3D IC and TSV technologies (6 papers) and Advanced Welding Techniques Analysis (6 papers). Hwa-Teng Lee collaborates with scholars based in Taiwan and Germany. Hwa-Teng Lee's co-authors include Ming‐Hung Chen, Fu-Chuan Hsu, Po‐Wei Chen, Edward W. Hsu, Joachim Mayer, Alexander Schwedt, Jialin Wu, Ching‐Hwei Chue, Hsiao‐Wei Chen and Yuan‐Chih Chang and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Processing Technology and Composite Structures.

In The Last Decade

Hwa-Teng Lee

21 papers receiving 701 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Hwa-Teng Lee Taiwan 10 624 565 135 89 87 21 737
Yan Cherng Lin China 12 686 1.1× 429 0.8× 388 2.9× 59 0.7× 180 2.1× 37 782
Ruyu Tian China 14 374 0.6× 374 0.7× 55 0.4× 63 0.7× 66 0.8× 30 563
Yoshiharu Kariya Japan 18 885 1.4× 1.0k 1.8× 34 0.3× 211 2.4× 230 2.6× 79 1.2k
Katia Vutova Bulgaria 12 231 0.4× 151 0.3× 69 0.5× 24 0.3× 74 0.9× 73 419
J.C.P. Pina Portugal 9 361 0.6× 121 0.2× 130 1.0× 214 2.4× 107 1.2× 16 488
Sung Joon Kim South Korea 12 275 0.4× 232 0.4× 16 0.1× 93 1.0× 47 0.5× 45 537
Chuanyang Lu China 15 362 0.6× 129 0.2× 23 0.2× 127 1.4× 123 1.4× 47 526
D.F. Paulonis United States 5 709 1.1× 68 0.1× 72 0.5× 131 1.5× 213 2.4× 8 772
Weiguo Jiang China 13 230 0.4× 95 0.2× 52 0.4× 38 0.4× 86 1.0× 31 372

Countries citing papers authored by Hwa-Teng Lee

Since Specialization
Citations

This map shows the geographic impact of Hwa-Teng Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hwa-Teng Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hwa-Teng Lee more than expected).

Fields of papers citing papers by Hwa-Teng Lee

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hwa-Teng Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hwa-Teng Lee. The network helps show where Hwa-Teng Lee may publish in the future.

Co-authorship network of co-authors of Hwa-Teng Lee

This figure shows the co-authorship network connecting the top 25 collaborators of Hwa-Teng Lee. A scholar is included among the top collaborators of Hwa-Teng Lee based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hwa-Teng Lee. Hwa-Teng Lee is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Hsu, Fu-Chuan, et al.. (2023). The Process Parameters of Micro Particle Bombarding (MPB) for Surface Integrity Enhancement of Cermet Material and Tool Steel. Micromachines. 14(3). 643–643. 1 indexed citations
2.
Ho, Ching-Yuan, et al.. (2020). Investigation of Various Bumps and Redistribution Lines to Inhibit Protected Silicon Nitride Cracks in High Pattern Density Chip Package. Journal of Electronic Materials. 49(9). 5613–5621. 1 indexed citations
3.
Lee, Hwa-Teng, et al.. (2012). Development of fine-grained structure and the mechanical properties of nickel-based Superalloy 718. Materials Science and Engineering A. 555. 13–20. 34 indexed citations
4.
Lee, Hwa-Teng, et al.. (2011). Effect of La addition on adhesive strength and fracture behavior of Sn–3.5Ag solder joints. Materials Science and Engineering A. 528(10-11). 3630–3638. 7 indexed citations
5.
Lee, Hwa-Teng, et al.. (2010). Effects of beam offset on mechanical properties and corrosion resistance of Alloy 690–SUS 304L EBW joints for nuclear power plant. Journal of Nuclear Materials. 401(1-3). 78–85. 11 indexed citations
6.
Lee, Hwa-Teng, et al.. (2009). Effects of Thermal Storage and Cu Addition on Adhesive Strength and Microstructure of Sn-3.0 mass% Ag-1.5 mass% Sb-<I>x</I>Cu Solder Joints. MATERIALS TRANSACTIONS. 50(4). 899–908. 1 indexed citations
7.
Lee, Hwa-Teng, et al.. (2009). Evolution of Ag<inf>3</inf>Sn compounds in solidification of eutectic Sn-3.5Ag solder. 1. 646–649. 4 indexed citations
8.
Lee, Hwa-Teng, et al.. (2009). Effect of cooling rate on Ag<inf>3</inf>Sn formation in Sn-Ag based lead-free solder. 875–878. 7 indexed citations
9.
Lee, Hwa-Teng, et al.. (2009). Influence of Lanthanum Additions on the Microstructure and Microhardness of Sn-3.5Ag Solder. Journal of Electronic Materials. 38(10). 2148–2157. 8 indexed citations
10.
Lee, Hwa-Teng, et al.. (2008). The Shear Strength and Fracture Behavior of Sn-Ag-xSb Solder Joints with Au/Ni-P/Cu UBM. Journal of Electronic Materials. 37(6). 867–873. 35 indexed citations
11.
Lee, Hwa-Teng, et al.. (2008). Effect of in addition on Sn-Ag-Sb lead-free solder system. 191–194. 3 indexed citations
12.
Lee, Hwa-Teng, et al.. (2007). The influence of working parameters and size effect on surface roughness during EDM process. 93–97. 2 indexed citations
13.
Lee, Hwa-Teng, et al.. (2006). Shear strength and interfacial microstructure of Sn–Ag–xNi/Cu single shear lap solder joints. Materials Science and Engineering A. 444(1-2). 75–83. 74 indexed citations
14.
Lee, Hwa-Teng, et al.. (2005). Reliability of Sn–Ag–Sb lead-free solder joints. Materials Science and Engineering A. 407(1-2). 36–44. 98 indexed citations
15.
Lee, Hwa-Teng, et al.. (2003). Surface Integrity in Micro-Hole Drilling Using Micro-Electro Discharge Machining. MATERIALS TRANSACTIONS. 44(12). 2718–2722. 7 indexed citations
16.
Lee, Hwa-Teng, et al.. (2003). Study of surface integrity using the small area EDM process with a copper–tungsten electrode. Materials Science and Engineering A. 364(1-2). 346–356. 115 indexed citations
17.
Chue, Ching‐Hwei, et al.. (2003). Effect of stiffness and thickness ratios on popcorn cracking in IC packages. IEEE Transactions on Components and Packaging Technologies. 26(2). 340–348. 2 indexed citations
18.
Lee, Hwa-Teng, et al.. (2003). Influence of interfacial intermetallic compound on fracture behavior of solder joints. Materials Science and Engineering A. 358(1-2). 134–141. 208 indexed citations
19.
Lee, Hwa-Teng, et al.. (2002). A general solution on stress singularities in the junction of two anisotropic materials. Composite Structures. 55(1). 81–93. 10 indexed citations
20.
Lee, Hwa-Teng, et al.. (2002). Effects of filler metal composition on joining properties of alloy 690 weldments. Materials Science and Engineering A. 338(1-2). 202–212. 77 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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