Houfu Dai

1.2k total citations
23 papers, 886 citations indexed

About

Houfu Dai is a scholar working on Biomedical Engineering, Materials Chemistry and Mechanical Engineering. According to data from OpenAlex, Houfu Dai has authored 23 papers receiving a total of 886 indexed citations (citations by other indexed papers that have themselves been cited), including 21 papers in Biomedical Engineering, 15 papers in Materials Chemistry and 14 papers in Mechanical Engineering. Recurrent topics in Houfu Dai's work include Advanced Surface Polishing Techniques (21 papers), Diamond and Carbon-based Materials Research (15 papers) and Advanced machining processes and optimization (14 papers). Houfu Dai is often cited by papers focused on Advanced Surface Polishing Techniques (21 papers), Diamond and Carbon-based Materials Research (15 papers) and Advanced machining processes and optimization (14 papers). Houfu Dai collaborates with scholars based in China, Germany and United States. Houfu Dai's co-authors include Genyu Chen, Qihong Fang, Shaobo Li, Jianbin Chen, Weilong Wu, Siyu Chen, Fa Zhang, Zhiquan Chen, Ping Li and Wenqiang Peng and has published in prestigious journals such as Nanoscale, Applied Surface Science and RSC Advances.

In The Last Decade

Houfu Dai

22 papers receiving 872 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Houfu Dai China 17 657 449 419 216 207 23 886
Dewen Zhao China 16 552 0.8× 203 0.5× 388 0.9× 286 1.3× 91 0.4× 55 729
Michaël Coulombier Belgium 14 209 0.3× 393 0.9× 257 0.6× 177 0.8× 256 1.2× 36 693
R. Steele United States 13 702 1.1× 358 0.8× 261 0.6× 287 1.3× 168 0.8× 25 1.1k
Dandan Yuan China 11 360 0.5× 340 0.8× 309 0.7× 101 0.5× 225 1.1× 15 600
N. Chandrasekaran United States 17 742 1.1× 642 1.4× 495 1.2× 207 1.0× 508 2.5× 23 1.2k
Kentaro Kawai Japan 17 602 0.9× 442 1.0× 132 0.3× 430 2.0× 95 0.5× 82 879
Andrew Breen Australia 24 730 1.1× 1.1k 2.3× 932 2.2× 78 0.4× 238 1.1× 66 1.8k
Zhenjiang Hu China 19 739 1.1× 183 0.4× 312 0.7× 292 1.4× 172 0.8× 61 1.0k
Michio Uneda Japan 9 390 0.6× 214 0.5× 214 0.5× 208 1.0× 104 0.5× 75 517
E. Vancoille Belgium 14 329 0.5× 389 0.9× 344 0.8× 298 1.4× 424 2.0× 33 845

Countries citing papers authored by Houfu Dai

Since Specialization
Citations

This map shows the geographic impact of Houfu Dai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Houfu Dai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Houfu Dai more than expected).

Fields of papers citing papers by Houfu Dai

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Houfu Dai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Houfu Dai. The network helps show where Houfu Dai may publish in the future.

Co-authorship network of co-authors of Houfu Dai

This figure shows the co-authorship network connecting the top 25 collaborators of Houfu Dai. A scholar is included among the top collaborators of Houfu Dai based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Houfu Dai. Houfu Dai is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Dai, Houfu & Wenqiang Peng. (2024). Materials removal mechanism for ultra-precise cutting of single-crystal silicon with natural single-crystal diamond tools by experiment and atomic simulation. International Journal of Refractory Metals and Hard Materials. 123. 106774–106774. 1 indexed citations
2.
Wu, Weilong, et al.. (2023). Quantitative analysis of grinding performance of cubic silicon carbide surface texture lubricated with water film. Tribology International. 180. 108267–108267. 27 indexed citations
3.
Wu, Weilong, et al.. (2023). Overview of titanium alloy cutting based on machine learning. The International Journal of Advanced Manufacturing Technology. 126(11-12). 4749–4762. 3 indexed citations
4.
Zhao, Liang, Junjie Zhang, Jianguo Zhang, et al.. (2023). Numerical simulation of materials-oriented ultra-precision diamond cutting: review and outlook. International Journal of Extreme Manufacturing. 5(2). 22001–22001. 65 indexed citations
5.
Wu, Weilong, et al.. (2022). Simulation of abrasive polishing process of single crystal silicon based on molecular dynamics. The International Journal of Advanced Manufacturing Technology. 121(11-12). 7195–7211. 4 indexed citations
6.
Wu, Weilong, et al.. (2022). Correction to: Simulation of abrasive polishing process of single crystal silicon based on molecular dynamics. The International Journal of Advanced Manufacturing Technology. 121(11-12). 7213–7213.
7.
8.
Dai, Houfu, et al.. (2021). Molecular dynamics simulation of ultra-precision machining 3C-SiC assisted by ion implantation. Journal of Manufacturing Processes. 69. 398–411. 41 indexed citations
9.
Dai, Houfu, Yuqi Zhou, Ping Li, & Yunfei Zhang. (2020). Evolution of nano-cracks in single-crystal silicon during ultraprecision mechanical polishing. Journal of Manufacturing Processes. 58. 627–636. 23 indexed citations
10.
Li, Ping, Siyu Chen, Houfu Dai, et al.. (2020). Recent advances in focused ion beam nanofabrication for nanostructures and devices: fundamentals and applications. Nanoscale. 13(3). 1529–1565. 192 indexed citations
11.
Dai, Houfu, Jingjing Chen, & Guojie Liu. (2019). A numerical study on subsurface quality and material removal during ultrasonic vibration assisted cutting of monocrystalline silicon by molecular dynamics simulation. Materials Research Express. 6(6). 65908–65908. 33 indexed citations
12.
Dai, Houfu, Fa Zhang, Yuqi Zhou, & Jianbin Chen. (2019). Numerical study of three-body diamond abrasive nanoindentation of single-crystal Si by molecular dynamics simulation. Applied Physics A. 125(5). 13 indexed citations
13.
Dai, Houfu, Hao Du, Jianbin Chen, & Genyu Chen. (2019). Influence of elliptical vibration on the behavior of silicon during nanocutting. The International Journal of Advanced Manufacturing Technology. 102(9-12). 3597–3612. 29 indexed citations
14.
Dai, Houfu, Hao Du, Jianbin Chen, & Genyu Chen. (2019). Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation. Proceedings of the Institution of Mechanical Engineers Part J Journal of Engineering Tribology. 233(8). 1208–1220. 16 indexed citations
15.
Dai, Houfu, Fa Zhang, & Jianbin Chen. (2019). A study of ultraprecision mechanical polishing of single-crystal silicon with laser nano-structured diamond abrasive by molecular dynamics simulation. International Journal of Mechanical Sciences. 157-158. 254–266. 63 indexed citations
16.
Dai, Houfu, Shaobo Li, & Genyu Chen. (2018). Molecular dynamics simulation of subsurface damage mechanism during nanoscratching of single crystal silicon. Proceedings of the Institution of Mechanical Engineers Part J Journal of Engineering Tribology. 233(1). 61–73. 38 indexed citations
17.
Dai, Houfu, et al.. (2017). Influence of laser nanostructured diamond tools on the cutting behavior of silicon by molecular dynamics simulation. RSC Advances. 7(25). 15596–15612. 38 indexed citations
18.
Dai, Houfu, Shaobo Li, & Genyu Chen. (2017). Comparison of subsurface damages on mono-crystalline silicon between traditional nanoscale machining and laser-assisted nanoscale machining via molecular dynamics simulation. Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms. 414. 61–67. 55 indexed citations
19.
20.
Dai, Houfu, et al.. (2016). A numerical study of ultraprecision machining of monocrystalline silicon with laser nano-structured diamond tools by atomistic simulation. Applied Surface Science. 393. 405–416. 96 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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