Hongwei Sun
- Biomedical Engineering top 5%
- Electrical and Electronic Engineering top 10%
- Materials Chemistry
- Mechanical Engineering top 10%
- Renewable Energy, Sustainability and the Environment top 10%
- Topics
- Acoustic Wave Resonator Technologies (21 papers)Advanced Fiber Optic Sensors (14 papers)Heat Transfer and Optimization (12 papers)
- Partner nations
- United StatesChinaSingapore
In The Last Decade
Hongwei Sun
103 papers receiving 1.5k citations
Peers
Comparison fields: 5 of 99
- Biomedical Engineering 790
- Electrical and Electronic Engineering 572
- Materials Chemistry 278
- Mechanical Engineering 262
- Renewable Energy, Sustainability and the Environment 188
Countries citing papers authored by Hongwei Sun
This map shows the geographic impact of Hongwei Sun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hongwei Sun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hongwei Sun more than expected).
Fields of papers citing papers by Hongwei Sun
This network shows the impact of papers produced by Hongwei Sun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hongwei Sun. The network helps show where Hongwei Sun may publish in the future.
Co-authorship network of co-authors of Hongwei Sun
This figure shows the co-authorship network connecting the top 25 collaborators of Hongwei Sun. A scholar is included among the top collaborators of Hongwei Sun based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hongwei Sun. Hongwei Sun is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 3 | |
| 3 | 9 | |
| 4 | 16 | |
| 5 | 13 | |
| 6 | 1 | |
| 7 | 14 | |
| 8 | 33 | |
| 9 | 11 | |
| 10 | 7 | |
| 11 | 4 | |
| 12 | 35 | |
| 13 | 16 | |
| 14 | 1 | |
| 15 | 27 | |
| 16 | 23 | |
| 17 | RESEARCH PROGRESS IN SYNTHESIS AND APPLICATION SITUATION OF P-CONTAINING ANTI-WEAR AND EXTREME PRESSURE ADDITIVES | 2 |
| 18 | Ionic Liquids: Progress and Prospective | 4 |
| 19 | EFFECTS OF SLIP-FLOW AND TEMPERATURE-JUMP ON MOMENTUM AND HEAT TRANSPORT IN MICRO-CHANNELS | 1 |
| 20 | 2 |
About Hongwei Sun
Hongwei Sun is a scholar working on Biomedical Engineering, Bioengineering and Surfaces, Coatings and Films, having authored 113 papers that have together received 1.5k indexed citations. Recurring topics across this work include Acoustic Wave Resonator Technologies (21 papers), Advanced Fiber Optic Sensors (14 papers) and Heat Transfer and Optimization (12 papers). The work is most often cited by research in Bioengineering (151 citations), Biomedical Engineering (790 citations) and Water Science and Technology (171 citations). Hongwei Sun has collaborated with scholars based in United States, China and Singapore. Frequent co-authors include Junwei Su, Mohammad Faghri, Majid Charmchi, Pengtao Wang, Zhiyong Gu, Ting Zhang, Hui Luo, Tie Li, Yan Xu and Lianhui Li. Their work appears in journals such as Applied Physics Letters, Journal of Applied Physics and Analytical Chemistry.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.