Hongge Li

1.1k total citations
59 papers, 819 citations indexed

About

Hongge Li is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Biomedical Engineering. According to data from OpenAlex, Hongge Li has authored 59 papers receiving a total of 819 indexed citations (citations by other indexed papers that have themselves been cited), including 27 papers in Electrical and Electronic Engineering, 18 papers in Mechanical Engineering and 13 papers in Biomedical Engineering. Recurrent topics in Hongge Li's work include High Entropy Alloys Studies (11 papers), Analog and Mixed-Signal Circuit Design (10 papers) and Additive Manufacturing Materials and Processes (7 papers). Hongge Li is often cited by papers focused on High Entropy Alloys Studies (11 papers), Analog and Mixed-Signal Circuit Design (10 papers) and Additive Manufacturing Materials and Processes (7 papers). Hongge Li collaborates with scholars based in China, United States and Hong Kong. Hongge Li's co-authors include Yunzhuo Lu, Jianfei Sun, Yongjiang Huang, Zuoxiang Qin, Lü Xing, Yongzhe Wang, Zhiliang Ning, Xing Lü, Songshan Jiang and Xiaoyu Gao and has published in prestigious journals such as Materials Science and Engineering A, IEEE Access and Sensors.

In The Last Decade

Hongge Li

54 papers receiving 800 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Hongge Li China 14 561 264 141 128 90 59 819
Ming You China 16 443 0.8× 146 0.6× 117 0.8× 62 0.5× 396 4.4× 37 1.1k
Yintao Wang China 15 204 0.4× 45 0.2× 87 0.6× 163 1.3× 53 0.6× 76 789
J. Zhang China 13 152 0.3× 90 0.3× 185 1.3× 117 0.9× 26 0.3× 33 547
M. S. Bhat India 12 168 0.3× 119 0.5× 95 0.7× 207 1.6× 150 1.7× 77 547
Muhammad Arsalan Saudi Arabia 18 153 0.3× 70 0.3× 155 1.1× 612 4.8× 284 3.2× 97 975
Seongwon Kim South Korea 18 277 0.5× 91 0.3× 163 1.2× 655 5.1× 190 2.1× 74 1.1k
Lei Gu China 13 334 0.6× 117 0.4× 300 2.1× 84 0.7× 40 0.4× 51 577
Xiaojie Zhou China 17 301 0.5× 98 0.4× 275 2.0× 300 2.3× 161 1.8× 40 847
Kai Zhao China 16 417 0.7× 46 0.2× 110 0.8× 71 0.6× 56 0.6× 47 575

Countries citing papers authored by Hongge Li

Since Specialization
Citations

This map shows the geographic impact of Hongge Li's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Hongge Li with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Hongge Li more than expected).

Fields of papers citing papers by Hongge Li

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Hongge Li. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Hongge Li. The network helps show where Hongge Li may publish in the future.

Co-authorship network of co-authors of Hongge Li

This figure shows the co-authorship network connecting the top 25 collaborators of Hongge Li. A scholar is included among the top collaborators of Hongge Li based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Hongge Li. Hongge Li is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Li, Hongge, et al.. (2025). Exact and approximate Radix-4 recoding multipliers for high-efficiency computation. Microelectronics Journal. 157. 106579–106579.
2.
Yang, Liang, Sabiha Sultana, Yongjiang Huang, et al.. (2025). Powder dynamics and molten pool characteristics in laser powder bed fusion of a CuSn10 alloy revealed by multi-dimensional in situ observations. Journal of Materials Research and Technology. 35. 7362–7370.
3.
Jang, Wen‐Yea, et al.. (2025). Notch structural stress theory: Part Ⅲ surface roughness effect on fatigue lives. International Journal of Fatigue. 197. 108938–108938. 1 indexed citations
4.
Li, Hongge, et al.. (2024). Recoding Hybrid Stochastic Numbers for Preventing Bit Width Accumulation and Fault Tolerance. IEEE Transactions on Circuits and Systems I Regular Papers. 72(3). 1243–1255. 13 indexed citations
5.
Ning, Zhiliang, et al.. (2023). The effect of cold drawing on the structure, tensile fracture strength and reliability of CuZrAl amorphous microwires. Materials Science and Engineering A. 881. 145421–145421. 3 indexed citations
6.
Li, Hongge, et al.. (2023). Hybrid Stochastic Number and Its Neural Network Computation. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 32(3). 432–441. 3 indexed citations
7.
Li, Hongge, et al.. (2023). A 3.58 nJ/Node Dual Cross Correlation Analog-Front-End Circuit With ADC for Mutual Capacitive Panel. IEEE Journal of Solid-State Circuits. 59(1). 282–293.
9.
Fu, Wujing, Hongge Li, Yongjiang Huang, Zhiliang Ning, & Jianfei Sun. (2022). A new strategy to overcome the strength-ductility trade off of high entropy alloy. Scripta Materialia. 214. 114678–114678. 39 indexed citations
10.
Li, Hongge, Wenjie Zhao, Chen Tian, et al.. (2022). Beneficial effects of deep cryogenic treatment on mechanical properties of additively manufactured high entropy alloy: cyclic vs single cryogenic cooling. Journal of Material Science and Technology. 115. 40–51. 33 indexed citations
11.
Li, Hongge, et al.. (2022). Stochastic Computing Using Amplitude and Frequency Encoding. IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 30(5). 656–660. 4 indexed citations
12.
Drucker, Natalie A., W. Christopher Shelley, Hongge Li, et al.. (2021). The assessment of microbiome changes and fecal volatile organic compounds during experimental necrotizing enterocolitis. Journal of Pediatric Surgery. 56(6). 1220–1225. 6 indexed citations
13.
Lu, Yunzhuo, et al.. (2017). Crack-free Fe-based amorphous coating synthesized by laser cladding. Materials Letters. 210. 46–50. 111 indexed citations
14.
Lu, Yunzhuo, Hongge Li, Hao Zhang, et al.. (2017). Zr-Based Metallic Glass Coating for Corrosion Resistance Improvement of 45 Steel. MATERIALS TRANSACTIONS. 58(9). 1319–1321. 13 indexed citations
15.
Ho, Ching-Sung, et al.. (2014). A Reliable Si3N4/Al2O3-HfO2Stack MIM Capacitor for High-Voltage Analog Applications. IEEE Transactions on Electron Devices. 61(8). 2944–2949. 10 indexed citations
16.
Zhang, Jianliang, et al.. (2014). Mechanism of Strength Improvement of Magnetite Pellet by Adding Boron-bearing Iron Concentrate. Journal of Iron and Steel Research International. 21(1). 9–15. 17 indexed citations
17.
Li, Hongge, et al.. (2013). Efficient hybrid neural network for spike sorting. Journal of Systems Engineering and Electronics. 24(1). 157–164. 2 indexed citations
18.
Li, Hongge, et al.. (2012). An efficient spike-sorting for implantable neural recording microsystem using hybrid neural network. PubMed. 19. 5274–5277. 2 indexed citations
19.
Wang, Yu, et al.. (2012). The Effective Mass, Band Gap, Device Characteristics, and Performance Considerations for AGNR and AGNRFETs. IEEE Transactions on Electron Devices. 59(9). 2290–2295. 3 indexed citations
20.
Li, Hongge, et al.. (2009). Micropower fully integrated CMOS readout interface for neural recording application. Microelectronics Reliability. 50(2). 273–281. 5 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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