H. Wensink

904 total citations
17 papers, 620 citations indexed

About

H. Wensink is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Ecological Modeling. According to data from OpenAlex, H. Wensink has authored 17 papers receiving a total of 620 indexed citations (citations by other indexed papers that have themselves been cited), including 8 papers in Electrical and Electronic Engineering, 7 papers in Biomedical Engineering and 5 papers in Ecological Modeling. Recurrent topics in H. Wensink's work include Erosion and Abrasive Machining (5 papers), Particle Dynamics in Fluid Flows (4 papers) and 3D IC and TSV technologies (4 papers). H. Wensink is often cited by papers focused on Erosion and Abrasive Machining (5 papers), Particle Dynamics in Fluid Flows (4 papers) and 3D IC and TSV technologies (4 papers). H. Wensink collaborates with scholars based in Netherlands, United Kingdom and Belgium. H. Wensink's co-authors include M. Elwenspoek, Albert van den Berg, Henri Jansen, Stefan Schlautmann, D.C. Hermes, Han Gardeniers, Erwin Berenschot, Willem Verboom, David N. Reinhoudt and Fernando Benito‐Lopez and has published in prestigious journals such as Lab on a Chip, Wear and Physica A Statistical Mechanics and its Applications.

In The Last Decade

H. Wensink

17 papers receiving 589 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name	h						Papers	Cites
H. Wensink Netherlands	11	359	198	183	118	91	17	620
Muhammad Naveed Germany	15	42 0.1×	286 1.4×	30 0.2×	293 2.5×	16 0.2×	31	627
Richard Liu United States	11	59 0.2×	90 0.5×	8 0.0×	93 0.8×	35 0.4×	59	523
Xian Meng China	14	44 0.1×	206 1.0×	3 0.0×	125 1.1×	19 0.2×	70	484
Xiaodong Yuan China	14	238 0.7×	174 0.9×	3 0.0×	136 1.2×	4 0.0×	67	643
Mohammad Mahmoudi Iran	20	240 0.7×	209 1.1×	3 0.0×	70 0.6×	6 0.1×	111	1.3k
Xiaodong Zeng China	14	157 0.4×	257 1.3×	15 0.1×	227 1.9×	10 0.1×	52	895
Andrea Benassi Italy	15	121 0.3×	184 0.9×	3 0.0×	335 2.8×	32 0.4×	39	858
Yoshihiko Uesugi Japan	14	81 0.2×	476 2.4×		204 1.7×	15 0.2×	95	849
U. Pedersen United Kingdom	5	149 0.4×	86 0.4×		132 1.1×	7 0.1×	10	514
Junsheng Cheng China	11	250 0.7×	116 0.6×		52 0.4×	6 0.1×	70	434

Countries citing papers authored by H. Wensink

Since Specialization

Citations

This map shows the geographic impact of H. Wensink's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by H. Wensink with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites H. Wensink more than expected).

Fields of papers citing papers by H. Wensink

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by H. Wensink. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by H. Wensink. The network helps show where H. Wensink may publish in the future.

Co-authorship network of co-authors of H. Wensink

This figure shows the co-authorship network connecting the top 25 collaborators of H. Wensink. A scholar is included among the top collaborators of H. Wensink based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with H. Wensink. H. Wensink is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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17 of 17 papers shown

Jong, Nico de, et al.. (2018). Exposed Die Fan-Out Wafer Level Packaging by Transfer Molding. 1–6. 2 indexed citations

Wang, Teng, Goedele Potoms, Kenneth June Rebibis, et al.. (2016). Low Warpage Wafer Level Transfer Molding Post 3D Die to Wafer Assembly. 843–848. 2 indexed citations

Wensink, H., et al.. (2016). Exposed die wafer level encapsulation by transfer molding. 1–4. 4 indexed citations

Moktadir, Z., Michaël Kraft, & H. Wensink. (2007). Multifractal properties of Pyrex and silicon surfaces blasted with sharp particles. Physica A Statistical Mechanics and its Applications. 387(8-9). 2083–2090. 20 indexed citations

Wensink, H., Fernando Benito‐Lopez, D.C. Hermes, et al.. (2005). Measuring reaction kinetics in a lab-on-a-chip by microcoil NMR. Lab on a Chip. 5(3). 280–280. 135 indexed citations

Moktadir, Z., H. Wensink, & Michaël Kraft. (2005). Analytical model of micromachining of brittle materials with sharp particles. Microelectronics Journal. 36(3-6). 608–611. 3 indexed citations

Wensink, H., D.C. Hermes, & Albert van den Berg. (2004). High signal to noise ratio in low field NMR on chip, simulations and experimental results. University of Twente Research Information. 407–410. 16 indexed citations

Tong, Hien D., Erwin Berenschot, Meint J. de Boer, et al.. (2003). Microfabrication of palladium-silver alloy membranes for hydrogen separation. Journal of Microelectromechanical Systems. 12(5). 622–629. 33 indexed citations

Wensink, H. & M. Elwenspoek. (2002). A closer look at the ductile–brittle transition in solid particle erosion. Wear. 253(9-10). 1035–1043. 97 indexed citations

10.

Wensink, H., Stefan Schlautmann, M.H. Goedbloed, & M. Elwenspoek. (2002). Fine tuning the roughness of powder blasted surfaces. Journal of Micromechanics and Microengineering. 12(5). 616–620. 30 indexed citations

11.

Wensink, H., et al.. (2002). Reduction of sidewall inclination and blast lag of powder blasted channels. Sensors and Actuators A Physical. 102(1-2). 157–164. 43 indexed citations

12.

Wensink, H., Erwin Berenschot, Henri Jansen, & M. Elwenspoek. (2002). High resolution powder blast micromachining. University of Twente Research Information. 769–774. 66 indexed citations

13.

Schlautmann, Stefan, H. Wensink, Richard B. M. Schasfoort, M. Elwenspoek, & Albert van den Berg. (2001). Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensors. Journal of Micromechanics and Microengineering. 11(4). 386–389. 87 indexed citations

14.

Jansen, Henri, M. de Boer, H. Wensink, B. Kloeck, & M. Elwenspoek. (2001). The black silicon method. VIII. A study of the performance of etching silicon using SF6/O2-based chemistry with cryogenical wafer cooling and a high density ICP source. Microelectronics Journal. 32(9). 769–777. 64 indexed citations

15.

Wensink, H., et al.. (2000). Mask materials for powder blasting. Journal of Micromechanics and Microengineering. 10(2). 175–180. 1 indexed citations

16.

Wensink, H., et al.. (1998). <title>First micromachined silicon load cell for loads up to 1000 kg</title>. Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE. 3514. 424–430. 14 indexed citations

17.

Speelman, Lambert, et al.. (1992). An evaluation of some disk coulter designs. Journal of Agricultural Engineering Research. 51. 67–80. 3 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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