Dongxu Qiao
- Aerospace Engineering top 0.5%
- High-Temperature Coating Behaviors 22
- Mechanical Engineering top 1%
- High Entropy Alloys Studies 24
- Advanced materials and composites 13
- Additive Manufacturing Materials and Processes 6
- Intermetallics and Advanced Alloy Properties 4
- Powder Metallurgy Techniques and Materials 1
- Metals and Alloys top 10%
-
- Titanium Alloys Microstructure and Properties 2
-
- Metal and Thin Film Mechanics 3
Dongxu Qiao
30 papers receiving 1.6k citations
Peers
Comparison fields: 5 of 60
- Aerospace Engineering 1.2k
- Mechanical Engineering 1.4k
- Metals and Alloys 32
- Energy Engineering and Power Technology 22
- Materials Chemistry 265
Countries citing papers authored by Dongxu Qiao
This map shows the geographic impact of Dongxu Qiao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dongxu Qiao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dongxu Qiao more than expected).
Fields of papers citing papers by Dongxu Qiao
This network shows the impact of papers produced by Dongxu Qiao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dongxu Qiao. The network helps show where Dongxu Qiao may publish in the future.
Co-authorship network
The 25 scholars most cited alongside Dongxu Qiao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2025 | 1 | |
| 2 | 2025 | 0 | |
| 3 | 2024 | 1 | |
| 4 | 2023 | 11 | |
| 5 | 2023 | 16 | |
| 6 | 2022 | 2 | |
| 7 | 2022 | 71 | |
| 8 | 2022 | 40 | |
| 9 | 2021 | 54 | |
| 10 | 2021 | 39 | |
| 11 | 2021 | 5 | |
| 12 | 2021 | 47 | |
| 13 | 2020 | 159 | |
| 14 | 2020 | 11 | |
| 15 | 2020 | 21 | |
| 16 | 2019 | 66 | |
| 17 | 2019 | 77 | |
| 18 | 2019 | 120 | |
| 19 | 2017 | 37 | |
| 20 | 2016 | 10 |
About Dongxu Qiao
Dongxu Qiao is a scholar working on Aerospace Engineering, Mechanical Engineering, General Materials Science, Ceramics and Composites and Catalysis, having authored 31 papers that have together received 1.6k indexed citations. Recurring topics across this work include High Entropy Alloys Studies (24 papers), High-Temperature Coating Behaviors (22 papers), Advanced materials and composites (13 papers), Additive Manufacturing Materials and Processes (6 papers), Intermetallics and Advanced Alloy Properties (4 papers), Metal and Thin Film Mechanics (3 papers), Titanium Alloys Microstructure and Properties (2 papers) and Powder Metallurgy Techniques and Materials (1 paper). The work is most often cited by research in Aerospace Engineering (1.2k citations), Mechanical Engineering (1.4k citations), Metals and Alloys (32 citations), Energy Engineering and Power Technology (22 citations) and Materials Chemistry (265 citations). Dongxu Qiao has collaborated with scholars based in China and United States. Frequent co-authors include Yiping Lu, Tingju Li, Hui Jiang, Zhiqiang Cao, Tongmin Wang, Peter K. Liaw, Kaiming Han, Hongliang Zhao, Wenna Jiao and Li Jiang. Their work appears in journals such as Journal of Material Science and Technology, Ceramics International, Materials Characterization, Materials Chemistry and Physics and Acta Metallurgica Sinica (English Letters).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.