Donghua Yang
- Electrical and Electronic Engineering
- Mechanical Engineering top 10%
- Materials Chemistry
- Biomedical Engineering
- Electronic, Optical and Magnetic Materials
- Topics
- Electronic Packaging and Soldering Technologies (21 papers)3D IC and TSV technologies (13 papers)Aluminum Alloys Composites Properties (11 papers)
In The Last Decade
Donghua Yang
49 papers receiving 605 citations
Peers
Comparison fields: 5 of 51
- Electrical and Electronic Engineering 280
- Mechanical Engineering 268
- Materials Chemistry 210
- Biomedical Engineering 113
- Electronic, Optical and Magnetic Materials 98
Countries citing papers authored by Donghua Yang
This map shows the geographic impact of Donghua Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Donghua Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Donghua Yang more than expected).
Fields of papers citing papers by Donghua Yang
This network shows the impact of papers produced by Donghua Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Donghua Yang. The network helps show where Donghua Yang may publish in the future.
Co-authorship network of co-authors of Donghua Yang
This figure shows the co-authorship network connecting the top 25 collaborators of Donghua Yang. A scholar is included among the top collaborators of Donghua Yang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Donghua Yang. Donghua Yang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 0 | |
| 3 | 0 | |
| 4 | 2 | |
| 5 | 3 | |
| 6 | 2 | |
| 7 | 38 | |
| 8 | 77 | |
| 9 | 34 | |
| 10 | 9 | |
| 11 | 0 | |
| 12 | 3 | |
| 13 | 10 | |
| 14 | 1 | |
| 15 | 3 | |
| 16 | 3 | |
| 17 | 7 | |
| 18 | 13 | |
| 19 | 57 | |
| 20 | 14 |
About Donghua Yang
Donghua Yang is a scholar working on Mechanical Engineering, Catalysis and Electrical and Electronic Engineering, having authored 55 papers that have together received 614 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (13 papers) and Aluminum Alloys Composites Properties (11 papers). The work is most often cited by research in Mechanical Engineering (268 citations), Catalysis (41 citations) and Renewable Energy, Sustainability and the Environment (93 citations). Donghua Yang has collaborated with scholars based in China, Australia and Ukraine. Frequent co-authors include Liangliang Li, Nianduan Lu, Zhimeng Guo, Xiaohua Zhang, Qing Cao, Hengxiang Li, Huiping Shao, Li’e Jin, Qun Wang and Bing Qin. Their work appears in journals such as Acta Materialia, Journal of Materials Chemistry A and Journal of Colloid and Interface Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.