Daihong Fu
- Electrical and Electronic Engineering top 5%
- Biomedical Engineering top 5%
- Computer Networks and Communications top 10%
- Signal Processing
- Hardware and Architecture top 10%
- Topics
- Analog and Mixed-Signal Circuit Design (10 papers)CCD and CMOS Imaging Sensors (8 papers)Sensor Technology and Measurement Systems (5 papers)
- Journals
- IEEE Journal of Solid-State CircuitsEURASIP Journal on Wireless Communications and NetworkingIEEE Transactions on Circuits and Systems I Fundamental Theory and Applications
- Partner nations
- United StatesChinaIsrael
In The Last Decade
Daihong Fu
11 papers receiving 664 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 689
- Biomedical Engineering 676
- Computer Networks and Communications 89
- Signal Processing 34
- Hardware and Architecture 32
Countries citing papers authored by Daihong Fu
This map shows the geographic impact of Daihong Fu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daihong Fu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daihong Fu more than expected).
Fields of papers citing papers by Daihong Fu
This network shows the impact of papers produced by Daihong Fu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daihong Fu. The network helps show where Daihong Fu may publish in the future.
Co-authorship network of co-authors of Daihong Fu
This figure shows the co-authorship network connecting the top 25 collaborators of Daihong Fu. A scholar is included among the top collaborators of Daihong Fu based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Daihong Fu. Daihong Fu is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 2 | |
| 2 | Microwave Imaging Reflectometry (MIR) on the DIII-D tokamak | 2 |
| 3 | 4 | |
| 4 | 0 | |
| 5 | 132 | |
| 6 | 7 | |
| 7 | 15 | |
| 8 | 14 | |
| 9 | 230 | |
| 10 | 8 | |
| 11 | 203 | |
| 12 | 97 |
About Daihong Fu
Daihong Fu is a scholar working on Computer Networks and Communications, Biomedical Engineering and Electrical and Electronic Engineering, having authored 12 papers that have together received 714 indexed citations. Recurring topics across this work include Analog and Mixed-Signal Circuit Design (10 papers), CCD and CMOS Imaging Sensors (8 papers) and Sensor Technology and Measurement Systems (5 papers). The work is most often cited by research in Biomedical Engineering (676 citations), Electrical and Electronic Engineering (689 citations) and Hardware and Architecture (32 citations). Daihong Fu has collaborated with scholars based in United States, China and Israel. Frequent co-authors include S.H. Lewis, P.J. Hurst, K.C. Dyer, Mandeep Singh, Benjamin Tobias, M. Chen, E. J. Valeo, Fengxia Hu and N.M. Ferraro. Their work appears in journals such as IEEE Journal of Solid-State Circuits, EURASIP Journal on Wireless Communications and Networking and IEEE Transactions on Circuits and Systems I Fundamental Theory and Applications.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.