Chuan Guo
- Mechanical Engineering top 2%
- Automotive Engineering top 1%
- Aerospace Engineering top 5%
- Materials Chemistry
- Mechanics of Materials top 10%
- Co-authors
- Qiang ZhuXiaogang HuXinggang LiGan LiZhen XuRobin WardYang ZhouJian Lü
- Topics
- Additive Manufacturing Materials and Processes (34 papers)High Entropy Alloys Studies (25 papers)Additive Manufacturing and 3D Printing Technologies (22 papers)
- Journals
- Advanced MaterialsSHILAP Revista de lepidopterologíaActa Materialia
- Partner nations
- ChinaHong KongUnited Kingdom
In The Last Decade
Chuan Guo
45 papers receiving 1.2k citations
Hit Papers
Peers
Comparison fields: 5 of 59
- Mechanical Engineering 1.2k
- Automotive Engineering 525
- Aerospace Engineering 226
- Materials Chemistry 188
- Mechanics of Materials 98
Countries citing papers authored by Chuan Guo
This map shows the geographic impact of Chuan Guo's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chuan Guo with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chuan Guo more than expected).
Fields of papers citing papers by Chuan Guo
This network shows the impact of papers produced by Chuan Guo. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chuan Guo. The network helps show where Chuan Guo may publish in the future.
Co-authorship network of co-authors of Chuan Guo
This figure shows the co-authorship network connecting the top 25 collaborators of Chuan Guo. A scholar is included among the top collaborators of Chuan Guo based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chuan Guo. Chuan Guo is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 1 | |
| 2 | 0 | |
| 3 | 2 | |
| 4 | 16 | |
| 5 | 4 | |
| 6 | 2 | |
| 7 | 14 | |
| 8 | 57 | |
| 9 | 8 | |
| 10 | 10 | |
| 11 | 2 | |
| 12 | 3 | |
| 13 | 53 | |
| 14 | 1 | |
| 15 | 44 | |
| 16 | 9 | |
| 17 | 34 | |
| 18 | 51 | |
| 19 | Additive manufacturing of Ni-based superalloys: Residual stress, mechanisms of crack formation and strategies for crack inhibitionbreakdown → | 160 |
| 20 | 28 |
About Chuan Guo
Chuan Guo is a scholar working on Automotive Engineering, Mechanical Engineering and Aerospace Engineering, having authored 47 papers that have together received 1.3k indexed citations. Recurring topics across this work include Additive Manufacturing Materials and Processes (34 papers), High Entropy Alloys Studies (25 papers) and Additive Manufacturing and 3D Printing Technologies (22 papers). The work is most often cited by research in Automotive Engineering (525 citations), Mechanical Engineering (1.2k citations) and Aerospace Engineering (226 citations). Chuan Guo has collaborated with scholars based in China, Hong Kong and United Kingdom. Frequent co-authors include Qiang Zhu, Xiaogang Hu, Xinggang Li, Gan Li, Zhen Xu, Robin Ward, Yang Zhou, Jian Lü, Hongxing Lu and Yuhe Huang. Their work appears in journals such as Advanced Materials, SHILAP Revista de lepidopterología and Acta Materialia.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.