Chia-Hong Hsieh
- Materials Chemistry
- Mechanics of Materials top 10%
- Mechanical Engineering
- Ceramics and Composites top 10%
- Electrical and Electronic Engineering
- Co-authors
- Verinder S. RanaRobb ThomsonR. ThomsonKuan-Wei LeeYi‐Jui LiuHsien-Chang LinYeong‐Her WangCheng‐Ming Peng
- Topics
- Semiconductor Quantum Structures and Devices (2 papers)Electronic Packaging and Soldering Technologies (2 papers)Radiomics and Machine Learning in Medical Imaging (1 paper)
- Journals
- Journal of Applied PhysicsJournal of The Electrochemical SocietyWorld Journal of Gastrointestinal Oncology
- Partner nations
- TaiwanUnited States
In The Last Decade
Chia-Hong Hsieh
4 papers receiving 356 citations
Peers
Comparison fields: 5 of 42
- Materials Chemistry 233
- Mechanics of Materials 173
- Mechanical Engineering 91
- Ceramics and Composites 64
- Electrical and Electronic Engineering 57
Countries citing papers authored by Chia-Hong Hsieh
This map shows the geographic impact of Chia-Hong Hsieh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chia-Hong Hsieh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chia-Hong Hsieh more than expected).
Fields of papers citing papers by Chia-Hong Hsieh
This network shows the impact of papers produced by Chia-Hong Hsieh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chia-Hong Hsieh. The network helps show where Chia-Hong Hsieh may publish in the future.
Co-authorship network of co-authors of Chia-Hong Hsieh
This figure shows the co-authorship network connecting the top 25 collaborators of Chia-Hong Hsieh. A scholar is included among the top collaborators of Chia-Hong Hsieh based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Chia-Hong Hsieh. Chia-Hong Hsieh is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 2 | |
| 3 | 2 | |
| 4 | GaAs FET IMD demands better standard | 1 |
| 5 | 93 | |
| 6 | 281 |
About Chia-Hong Hsieh
Chia-Hong Hsieh is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering and Atomic and Molecular Physics, and Optics, having authored 6 papers that have together received 379 indexed citations. Recurring topics across this work include Semiconductor Quantum Structures and Devices (2 papers), Electronic Packaging and Soldering Technologies (2 papers) and Radiomics and Machine Learning in Medical Imaging (1 paper). The work is most often cited by research in Ceramics and Composites (64 citations), Metals and Alloys (20 citations) and Mechanics of Materials (173 citations). Chia-Hong Hsieh has collaborated with scholars based in Taiwan and United States. Frequent co-authors include Verinder S. Rana, Robb Thomson, R. Thomson, Kuan-Wei Lee, Yi‐Jui Liu, Hsien-Chang Lin, Yeong‐Her Wang, Yeong‐Her Wang, Cheng‐Ming Peng and Shao-Chieh Lin. Their work appears in journals such as Journal of Applied Physics, Journal of The Electrochemical Society and World Journal of Gastrointestinal Oncology.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.