Ai‐Ping Xian
About
In The Last Decade
Ai‐Ping Xian
41 papers receiving 371 citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 254
- Mechanical Engineering 236
- Materials Chemistry 119
- General Materials Science 43
- Aerospace Engineering 37
Countries citing papers authored by Ai‐Ping Xian
This map shows the geographic impact of Ai‐Ping Xian's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ai‐Ping Xian with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ai‐Ping Xian more than expected).
Fields of papers citing papers by Ai‐Ping Xian
This network shows the impact of papers produced by Ai‐Ping Xian. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ai‐Ping Xian. The network helps show where Ai‐Ping Xian may publish in the future.
Co-authorship network of co-authors of Ai‐Ping Xian
This figure shows the co-authorship network connecting the top 25 collaborators of Ai‐Ping Xian. A scholar is included among the top collaborators of Ai‐Ping Xian based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Ai‐Ping Xian. Ai‐Ping Xian is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | Density Measurement of Liquid Indium Using r--Ray Attenuation Method | 1 |
| 2 | 7 | |
| 3 | Solderability of electrodeposited Fe-Ni alloys with eutectic SnAgCu solder | 25 |
| 4 | 12 | |
| 5 | Influence of Trace Ge on Oxidation of Liquid Tin in Atmosphere | 2 |
| 6 | 18 | |
| 7 | Microstructure and Fracture of Pb-free Solder Interconnects in Ceramic Ball Grid Array Packages under Thermal Cycling | 3 |
| 8 | 21 | |
| 9 | 21 | |
| 10 | Interfacial reaction between eutectic Sn-58Bi lead-free solder and electroless Ni-P plating | 5 |
| 11 | Effect of strain rate on the tensile properties of Sn-9Zn eutectic alloy | 1 |
| 12 | Low cycle fatigue behavior of Sn-3.8Ag-0.7Cu lead-free solder | 1 |
| 13 | 9 | |
| 14 | Deformation and microstructure refinement of CuCr25 alloy | 1 |
| 15 | Cu-Cr contact materials for high power vacuum interrupters | 1 |
| 16 | IMPURITIES IN STEEL AND THEIR INFLUENCE ON STEEL PROPERTIES | 5 |
| 17 | 10 | |
| 18 | PREPARATION OF HOMOGENEITY IMMISCIBLE ALLOY BY MARANGONI CONVECTION | 5 |
| 19 | 9 | |
| 20 | TRAPPING OF HYDROGEN BY PRECIPITATE TiC IN LOW CARBON STEEL | 5 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.