Abdullah Aziz Saad
About
In The Last Decade
Abdullah Aziz Saad
44 papers receiving 444 citations
Peers
Comparison fields: 5 of 52
- Mechanical Engineering 308
- Mechanics of Materials 218
- Electrical and Electronic Engineering 171
- Materials Chemistry 87
- Biomedical Engineering 57
Countries citing papers authored by Abdullah Aziz Saad
This map shows the geographic impact of Abdullah Aziz Saad's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Abdullah Aziz Saad with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Abdullah Aziz Saad more than expected).
Fields of papers citing papers by Abdullah Aziz Saad
This network shows the impact of papers produced by Abdullah Aziz Saad. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Abdullah Aziz Saad. The network helps show where Abdullah Aziz Saad may publish in the future.
Co-authorship network of co-authors of Abdullah Aziz Saad
This figure shows the co-authorship network connecting the top 25 collaborators of Abdullah Aziz Saad. A scholar is included among the top collaborators of Abdullah Aziz Saad based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Abdullah Aziz Saad. Abdullah Aziz Saad is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 2 | |
| 3 | 0 | |
| 4 | 3 | |
| 5 | 1 | |
| 6 | 1 | |
| 7 | 1 | |
| 8 | Climate change impact on pulse in India- A review | 4 |
| 9 | 2 | |
| 10 | SOLDERING CHARACTERISTICS AND THERMO- MECHANICAL PROPERTIES OF Pb-FREE SOLDER PASTE FOR REFLOW SOLDERING | 1 |
| 11 | 4 | |
| 12 | TIO2 Nanoparticles Reinforced Lead-Free 96.5Sn–3.0Ag–0.5Cu Solder Paste for Ultra-Fine Package Assembly in Reflow Soldering Process | 1 |
| 13 | Experimental Study of Self-Alignment during Reflow Soldering Process | 10 |
| 14 | 7 | |
| 15 | 27 | |
| 16 | 16 | |
| 17 | 4 | |
| 18 | 10 | |
| 19 | 27 | |
| 20 | 3 |
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.