Ying-Lang Wang

LAMMPS - a flexible simulation tool for particle-based materials modeling at the atomic, meso, and continuum scales

Alternative Plasmonic Materials: Beyond Gold and Silver

Progress and Perspectives of Electrochemical CO₂ Reduction on Copper in Aqueous Electrolyte

Polycrystalline and Single‐Crystal Cu Electrodes: Influence of Experimental Conditions on the Electrochemical Properties in Alkaline Media

Structure, electronic properties and electron energy loss spectra of transition metal nitride films

Classical atomistic simulations of surfaces and heterogeneous interfaces with the charge-optimized many body (COMB) potentials

Effect of copper barrier dielectric deposition process on characterization of copper interconnect

The electrical property of plasma-treated Ta/TaNx diffusion barrier

Effect of Cu-Ion Concentration in Concentrated H[sub 3]PO[sub 4] Electrolyte on Cu Electrochemical Mechanical Planarization