W. J. Maeng

The route for commercial photoelectrochemical water splitting: a review of large-area devices and key upscaling challenges

Monolithic three-dimensional tier-by-tier integration via van der Waals lamination

Atomic layer deposited p-type copper oxide thin films and the associated thin film transistor properties

The conducting tin oxide thin films deposited via atomic layer deposition using Tetrakis-dimethylamino tin and peroxide for transparent flexible electronics