Immediate Impact
1 standout
Citing Papers
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Works of Ting-Chi Wang being referenced
Fast Fixed-Outline 3-D IC Floorplanning With TSV Co-Placement
2012
Through-Silicon Via Planning in 3-D Floorplanning
2010
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Ting-Chi Wang | 161 | 65 | 55 | 24 | 190 | |
| Yiyu Shi | 191 | 66 | 19 | 33 | 226 | |
| Ding-Ming Kwai | 157 | 83 | 95 | 37 | 226 | |
| Kai-Yuan Chao | 168 | 84 | 45 | 26 | 202 | |
| Vivek Chaturvedi | 95 | 129 | 92 | 18 | 213 | |
| Jean-Philippe Diguet | 84 | 61 | 49 | 27 | 172 | |
| Eren Kursun | 204 | 91 | 51 | 20 | 256 | |
| Karthik Chandrasekar | 97 | 109 | 74 | 23 | 202 | |
| Peter K. K. Loh | 101 | 45 | 165 | 26 | 198 | |
| Heba Khdr | 127 | 152 | 120 | 20 | 218 | |
| Pingqiang Zhou | 90 | 25 | 32 | 36 | 140 |
All Works
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