Citation Impact
4 standout
Citing Papers
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Heat and fluid flow in high-power LED packaging and applications
2016 Standout
Works of T.F. Lemczyk being referenced
Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
2000
Thermal constriction resistance with convective boundary conditions—1. Half-space contacts
1988
Author Peers
| Author | MM | Mechanical Engineering | Automotive Engineering | EEE | Last Decade | Papers | Cites |
|---|---|---|---|---|---|---|---|
| T.F. Lemczyk | 41 | 69 | 7 | 36 | 10 | 138 | |
| Amany A. Tohamy | 2 | 20 | 405 | ||||
| N Harada | 3 | 5 | 6 | 6 | 21 | 473 | |
| Chang Seoul | 16 | 31 | 4 | 203 | 27 | 432 | |
| Eric Daniel Fournier | 4 | 5 | 59 | 13 | 255 | ||
| Mary Leslie | 1 | 8 | 363 |
All Works
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