Citation Impact
6 standout
Citing Papers
Roadmapping the next generation of silicon photonics
2024 Standout
Monolithic three-dimensional integration of complementary two-dimensional field-effect transistors
2024 Standout
Works of T.C. Chai being referenced
Development of 3-D Silicon Module With TSV for System in Packaging
2010
Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps
2009
Author Peers
| Author | EEE | Mechanical Engineering | MM | Biomedical Engineering | EOMM | Last Decade | Papers | Cites |
|---|---|---|---|---|---|---|---|---|
| T.C. Chai | 318 | 41 | 22 | 67 | 45 | 16 | 342 | |
| Hwa-Mi Lee | 1 | 1 | 1 | 5 | 20 | 387 | ||
| R. C. Joshi | 86 | 1 | 1 | 18 | 12 | 20 | 220 | |
| Johanna Dahllund | 1 | 1 | 28 | 1 | 9 | 649 | ||
| Shifeng Yun | 5 | 9 | 14 | 146 | 6 | 5 | 497 | |
| Claudio Ballabio | 1 | 43 | 1 | 6 | 186 |
All Works
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