Standout Papers

HotSpot: a compact thermal modeling methodology for early-stage VLSI design 2006 2026 2012 2019 474
  1. HotSpot: a compact thermal modeling methodology for early-stage VLSI design (2006)
    Wei Huang, Sudeep Ghosh et al. IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Immediate Impact

12 standout
Sub-graph 1 of 6

Citing Papers

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Thermoelectric coolers for on-chip thermal management: Materials, design, and optimization
2022 Standout
4 intermediate papers

Works of Sudeep Ghosh being referenced

HotSpot: a compact thermal modeling methodology for early-stage VLSI design
2006 Standout

Author Peers

Author Last Decade Papers Cites
Sudeep Ghosh 29 20 185 374 236 7 492
Sivakumar Velusamy 11 25 191 374 346 4 526
Michael Wieckowski 14 11 87 448 149 9 509
Vasantha Erraguntla 10 15 422 337 359 8 562
Emily Blem 43 61 210 237 262 10 453
Greg Ruhl 8 15 419 343 332 6 568
Alessandro Vincenzi 14 2 83 342 113 8 416
Volker Strumpen 35 22 472 186 428 13 563
Renée St. Amant 49 53 175 273 234 7 434
W.C. Athas 72 4 194 248 189 10 476
Smith 71 8 78 287 176 17 517

All Works

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2026