Citation Impact
Citing Papers
Robust Microfabrication of Highly Parallelized Three-Dimensional Microfluidics on Silicon
2019
Two-dimensional flexible nanoelectronics
2014 Standout
Electronics based on two-dimensional materials
2014 Standout
E-waste: An assessment of global production and environmental impacts
2009 Standout
Memristive devices for computing
2012 Standout
Training and operation of an integrated neuromorphic network based on metal-oxide memristors
2015 StandoutNature
Four-channel reconfigurable optical add-drop multiplexer based on photonic wire waveguide
2009
Autonomic Restoration of Electrical Conductivity
2011
Impact of the ROHS Directive on high-performance electronic systems
2006
Device Requirements for Optical Interconnects to Silicon Chips
2009 Standout
Emerging challenges and materials for thermal management of electronics
2014 Standout
Highly Thermally Conductive Yet Electrically Insulating Polymer/Boron Nitride Nanosheets Nanocomposite Films for Improved Thermal Management Capability
2018 Standout
Four-dimensional address topology for circuits with stacked multilayer crossbar arrays
2009
Thermal conductivity of polymer-based composites: Fundamentals and applications
2016 Standout
Low‐Temperature Sintering and Microwave Dielectric Properties of Anorthite‐Based Glass‐Ceramics
2002
Electric-field-induced pattern formation in colloidal dispersions
1995 Nature
Silicon microring resonators
2011 Standout
La<sub>2</sub>O<sub>3</sub>/Al<sub>2</sub>O<sub>3</sub>/B<sub>2</sub>O<sub>3</sub> Based Glass-Ceramics for LTCC Application
2007
Exploitation of optical interconnects in future server architectures
2005
Stretchable and Soft Electronics using Liquid Metals
2017 Standout
Lab-on-Skin: A Review of Flexible and Stretchable Electronics for Wearable Health Monitoring
2017 Standout
Polymer/layered silicate nanocomposites: a review from preparation to processing
2003 Standout
One‐Dimensional Nanostructures: Synthesis, Characterization, and Applications
2003 Standout
High-Performance Flexible Thin-Film Transistors Exfoliated from Bulk Wafer
2012
Low loss dielectric materials for LTCC applications: a review
2008 Standout
Scalable mRNA and siRNA Lipid Nanoparticle Production Using a Parallelized Microfluidic Device
2021 StandoutNobel
Throughput-scalable manufacturing of SARS-CoV-2 mRNA lipid nanoparticle vaccines
2023 StandoutNobel
25th Anniversary Article: The Evolution of Electronic Skin (E‐Skin): A Brief History, Design Considerations, and Recent Progress
2013 Standout
Works of John Knickerbocker being referenced
Thermomechanical modeling of 3D electronic packages
2008
IBM System/390 air-cooled alumina thermal conduction module
1991
3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections
2008
An overview of through-silicon-via technology and manufacturing challenges
2015
Three-dimensional silicon integration
2008
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
2005
High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution
1992