Hiroshi Tsuge

Predictive models for the surface roughness and subsurface damage depth of semiconductor materials in precision grinding

A novel liquid film shearing polishing technique for silicon carbide and its processing damage mechanisms

Growth of Low Basal Plane Dislocation Density 4H-SiC Crystals in Controlled Temperature Distribution inside the Crucible

Development of Lapping and Polishing Technologies of 4H-SiC Wafers for Power Device Applications