Immediate Impact
1 standout
Citing Papers
Recent Advances and Trends in Advanced Packaging
2022 Standout
Works of Henry Yang being referenced
Characterizations of Fan-out Wafer-Level Packaging
2017
Author Peers
| Author | Last Decade | Papers | Cites | |||
|---|---|---|---|---|---|---|
| Henry Yang | 6 | 2 | 3 | 5 | 8 | |
| M. Stadler | 6 | 3 | 5 | 8 | ||
| Y. J. Sun | 6 | 3 | 5 | 10 | ||
| D. Dattola | 6 | 3 | 4 | 8 | ||
| P. Graehling | 6 | 3 | 4 | 8 | ||
| S. Di Carlo | 7 | 1 | 3 | 5 | 9 | |
| C. Meroni | 5 | 3 | 4 | 8 | ||
| Y.G. Kim | 5 | 1 | 3 | 4 | 7 | |
| M. Sofo Haro | 6 | 4 | 5 | 8 | ||
| F. Obier | 5 | 3 | 6 | 6 | ||
| C. Drennan | 7 | 4 | 6 | 7 |
All Works
Loading papers...