Immediate Impact
1 standout
Citing Papers
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Works of Gary Yeap being referenced
Integrated Algorithm for 3-D IC Through-Silicon Via Assignment
2013
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| Gary Yeap | 27 | 5 | 11 | 13 | 6 | 36 | |
| A. Prodon | 9 | 25 | 3 | 6 | 34 | ||
| Pei-Ning Guo | 33 | 23 | 2 | 3 | 5 | 35 | |
| Pengcheng Yao | 10 | 10 | 4 | 2 | 7 | 35 | |
| Luis Silva | 12 | 7 | 4 | 5 | 38 | ||
| Meltem Sönmez Turan | 12 | 6 | 4 | 5 | 28 | ||
| Benoît Meister | 5 | 25 | 5 | 5 | 7 | 34 | |
| D.K. Bhavsar | 22 | 23 | 4 | 7 | 36 | ||
| Ruslan Smeliansky | 6 | 6 | 6 | 8 | 31 | ||
| Seonil Choi | 14 | 18 | 5 | 8 | 30 | ||
| Jorge Nakahara | 15 | 2 | 3 | 6 | 34 |
All Works
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