Citation Impact

7 from Science/Nature 70 standout
Sub-graph 1 of 25

Citing Papers

Roadmapping the next generation of silicon photonics
2024 Standout
Monolithic three-dimensional integration of complementary two-dimensional field-effect transistors
2024 Standout
1 intermediate paper

Works of E.B. Liao being referenced

Development of Large Die Fine-Pitch Cu/Low-$k$ FCBGA Package With Through Silicon via (TSV) Interposer
2011
Development of 3-D Silicon Module With TSV for System in Packaging
2010

Author Peers

Author EEE Biomedical Engineering Materials Chemistry Last Decade Papers Cites
E.B. Liao 207 85 34 18 249
Simon Fitzpatrick 6 3 11 389
D. M. Manaker 9 517
Muhammad Rizki 65 29 14 2 1.4k
Catherine Gordon 1 30 257
Delphine Chamousset 9 3 12 462

All Works

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Rankless by CCL
2026