Immediate Impact
1 standout
Citing Papers
A review of lead-free solders for electronics applications
2017 Standout
Works of E. Pek being referenced
Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact
2006
Impact life prediction modeling of TFBGA packages under board level drop test
2004
Author Peers
| Author | Last Decade | Papers | Cites | |||||
|---|---|---|---|---|---|---|---|---|
| E. Pek | 159 | 54 | 27 | 3 | 167 | |||
| Stefon E. Shelton | 92 | 119 | 17 | 5 | 209 | |||
| M.I. Haller | 111 | 151 | 31 | 5 | 252 | |||
| M.H. Badi | 102 | 100 | 18 | 3 | 199 | |||
| B.G. LIPTÁK | 61 | 38 | 23 | 6 | 128 | |||
| K. Houston | 67 | 78 | 11 | 4 | 205 | |||
| S. Calmes | 162 | 1 | 66 | 35 | 6 | 276 | ||
| P.-C. Eccardt | 70 | 116 | 16 | 5 | 244 | |||
| N. Wongkomet | 128 | 17 | 22 | 3 | 182 | |||
| James Gigliotti | 74 | 121 | 19 | 3 | 275 | |||
| Christopher Mak | 229 | 12 | 47 | 2 | 261 |
All Works
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