Immediate Impact

2 from Science/Nature 43 standout
Sub-graph 1 of 21

Citing Papers

Stress-mediated copper-molybdenum alloy enables boosted hydrogen evolution activity
2025 Standout
The novel high-entropy alloy filler realized the efficient inhibition of the violent reaction and brittle phase formation in the SiCf/SiC heterogeneous brazed joint
2025 Standout
2 intermediate papers

Works of Dung-Ching Perng being referenced

1-nm-thick graphene tri-layer as the ultimate copper diffusion barrier
2014
Thermal and Electrical Properties of PVD Ru(P) Film as Cu Diffusion Barrier
2009

Author Peers

Author Last Decade Papers Cites
Dung-Ching Perng 247 157 175 23 343
Dongxu Zhao 244 136 288 26 375
Mudassar Meer 156 121 161 22 356
M. Fujii 194 122 335 18 382
Christopher Jezewski 285 120 205 19 356
J. Koprinarova 298 78 199 21 408
M. L. Green 314 105 161 17 376
B. Meyer 224 61 267 27 371
Le Yu 147 136 90 25 319
Süleyman Çabuk 182 143 287 30 377
Yoann Tomczak 299 119 195 16 383

All Works

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2026