Cornelia Tsang

Tunnel field-effect transistors as energy-efficient electronic switches

Two-dimensional flexible nanoelectronics

Electronics based on two-dimensional materials

Memristive devices for computing

Training and operation of an integrated neuromorphic network based on metal-oxide memristors

Four-channel reconfigurable optical add-drop multiplexer based on photonic wire waveguide

Autonomic Restoration of Electrical Conductivity

Device Requirements for Optical Interconnects to Silicon Chips

Emerging challenges and materials for thermal management of electronics

Highly Thermally Conductive Yet Electrically Insulating Polymer/Boron Nitride Nanosheets Nanocomposite Films for Improved Thermal Management Capability

Four-dimensional address topology for circuits with stacked multilayer crossbar arrays

Thermal conductivity of polymer-based composites: Fundamentals and applications

Silicon microring resonators

Exploitation of optical interconnects in future server architectures

Stretchable and Soft Electronics using Liquid Metals

Lab-on-Skin: A Review of Flexible and Stretchable Electronics for Wearable Health Monitoring

High-Performance Flexible Thin-Film Transistors Exfoliated from Bulk Wafer

Practical Strategies for Power-Efficient Computing Technologies

25th Anniversary Article: The Evolution of Electronic Skin (E‐Skin): A Brief History, Design Considerations, and Recent Progress

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Three-dimensional silicon integration

Fabrication and characterization of robust through-silicon vias for silicon-carrier applications

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection