Citation Impact
Citing Papers
Memory effects in individual submicrometer ferromagnets
1998 StandoutNobel
Flexible high-temperature dielectric materials from polymer nanocomposites
2015 StandoutNature
Alternative Plasmonic Materials: Beyond Gold and Silver
2013 Standout
Electronics based on two-dimensional materials
2014 Standout
Single spin detection by magnetic resonance force microscopy
2004 StandoutNature
Atomic Layer Deposition Chemistry: Recent Developments and Future Challenges
2003 Standout
Electron microscopy of specimens in liquid
2011 Standout
Electrografting: a powerful method for surface modification
2011 Standout
Attosecond nonlinear polarization and light–matter energy transfer in solids
2016 StandoutNatureNobel
Magnetic Flux Noise in dc SQUIDs: Temperature and Geometry Dependence
2013 StandoutNobel
Dynamic microscopy of nanoscale cluster growth at the solid–liquid interface
2003 Standout
Optical-field-induced current in dielectrics
2012 StandoutNatureNobel
An ultra-lightweight design for imperceptible plastic electronics
2013 StandoutNature
Room-temperature fabrication of transparent flexible thin-film transistors using amorphous oxide semiconductors
2004 StandoutNature
Low Dielectric Constant Materials for ULSI Interconnects
2000
Novel applications of X-ray analysis to microelectronic materials and devices
2002
In situ x-ray microscopic observation of the electromigration in passivated Cu interconnects
2001
A critical review of high entropy alloys and related concepts
2016 Standout
Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale
2009 StandoutScience
Effect of current crowding on vacancy diffusion and void formation in electromigration
2000
Atomic-level structure and structure–property relationship in metallic glasses
2010 Standout
Selectivity Enhancement of Electroless Co Deposition for Cu Capping Process via Spontaneous Diazonium Ion Reduction
2007
Attosecond metrology: from electron capture to future signal processing
2014 StandoutNobel
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2002 Standout
Electromigration drift and threshold in Cu thin-film interconnects
1996
Design principles for electrolytes and interfaces for stable lithium-metal batteries
2016 Standout
Electromigration of eutectic SnPb solder interconnects for flip chip technology
2001
Electromigration in eutectic SnPb solder lines
2001
High-Resolution EM of Colloidal Nanocrystal Growth Using Graphene Liquid Cells
2012 StandoutScience
Damascene copper electroplating for chip interconnections
1998 Standout
High spatial resolution grain orientation and strain mapping in thin films using polychromatic submicron x-ray diffraction
2002
New Approaches to Nanofabrication: Molding, Printing, and Other Techniques
2005 Standout
Self-Assembled Monolayers of Thiolates on Metals as a Form of Nanotechnology
2005 Standout
Spintronics: Fundamentals and applications
2004 Standout
Flux1 / f α
2014 StandoutNobel
Investigation of Low-Frequency Excess Flux Noise in DC SQUIDs at mK Temperatures
2010
Recent low temperature SQUID developments
1994
Growth of cubic-TaN thin films by plasma-enhanced atomic layer deposition
2002
Molecular Electronics with Carbon Nanotubes
2002 Standout
Advances in the coordination chemistry of nitrogen ligand complexes of coinage metals
2010
Diamond-like amorphous carbon
2002 Standout
X-ray microdiffraction study of Cu interconnects
2000
Planar Heterojunction Perovskite Solar Cells via Vapor-Assisted Solution Process
2013 Standout
Multiprincipal-Element AlCrTaTiZr-Nitride Nanocomposite Film of Extremely High Thermal Stability as Diffusion Barrier for Cu Metallization
2009
Comparative Study of Cu–CVD Seed Layer Deposition on Ru and Ta Underlayers
2006
Atomic Layer Deposition: An Overview
2009 Standout
Distribution of magnetic flux in high-T c
1995
VLSI on-chip interconnection performance simulations and measurements
1995
Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits
2003 Standout
Electromigration threshold in copper interconnects
2001
Metal Azolate Frameworks: From Crystal Engineering to Functional Materials
2011 Standout
Structure Evolution During Processing of Polycrystalline Films
2000
Magnetic resonance force microscopy
1995
Electroforming of Copper Structures at Nanometer-Sized Gaps of Self-assembled Monolayers on Silver
2002
Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization
2001
High-transition-temperature superconducting quantum interference devices
1999 StandoutNobel
Surface chemistry of atomic layer deposition: A case study for the trimethylaluminum/water process
2005 Standout
Pure dephasing in flux qubits due to flux noise with spectral density scaling as1 / f α
2012 StandoutNobel
Polymer/layered silicate nanocomposites: a review from preparation to processing
2003 Standout
Atomic layer deposition of metal and nitride thin films: Current research efforts and applications for semiconductor device processing
2003
Effects of contact resistance and film thickness on current crowding and the critical product of electromigration in Blech structures
2001
Low dielectric constant materials for microelectronics
2003 Standout
Reliability and Copper Interconnections with Low Dielectric Constant Materials
1998
Electromigration reliability issues in dual-damascene Cu interconnections
2002
Physics and materials challenges for lead-free solders
2003
Solvent Annealing of Perovskite‐Induced Crystal Growth for Photovoltaic‐Device Efficiency Enhancement
2014 Standout
Direct observation of a critical length effect in dual-damascene Cu/oxide interconnects
2001
Current-crowding-induced electromigration failure in flip chip solder joints
2002
High-Resolution Scanning X-ray Diffraction Microscopy
2008 StandoutScience
Organic Thin Film Transistors for Large Area Electronics
2002 Standout
Low dielectric constant polymers for microelectronics
2001 Standout
Preparation, structure, properties and thermal behavior of rigid-rod polyimide/montmorillonite nanocomposites
2001
Microstructure-electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
1999
Colloquium: Strong-field phenomena in periodic systems
2018 StandoutNobel
Measuring strain distributions in amorphous materials
2004
Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper
2008 Science
Fractional vortices on grain boundaries: The case for broken time-reversal symmetry in high-temperature superconductors
1997 StandoutNobel
Microstructures and properties of high-entropy alloys
2013 Standout
Electrical resistivity of ultrafine-grained copper with nanoscale growth twins
2007
Demonstrated Reliability of 4-Mb MRAM
2004
Diffusion barrier properties of transition metal thin films grown by plasma-enhanced atomic-layer deposition
2002
The Changing Automotive Environment: High-Temperature Electronics
2004 Standout
Radical-Enhanced Atomic Layer Deposition of Metallic Copper Thin Films
2004
Electromigration in Sn–Pb solder strips as a function of alloy composition
2000
Nanofocusing parabolic refractive x-ray lenses
2003
Fundamentals of Modern VLSI Devices
2009 Standout
Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization
2001
Influence of Crystal Orientation of Ru Under-Layer on Initial Growth of Copper Chemical Vapor Deposition
2006
Exchange bias in nanostructures
2005 Standout
Perovskite lead-free dielectrics for energy storage applications
2018 Standout
Recent advances on electromigration in very-large-scale-integration of interconnects
2003 Standout
Revealing the Maximum Strength in Nanotwinned Copper
2009 StandoutScience
Electromigration in Cu interconnects with very different grain structures
2001
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
2001
Works of C.‐K. Hu being referenced
Submicron Tungsten Gate MOSFET with 10 nm Gate Oxide
1987
Electromigration of copper in Al(0.25 at. % Cu) conductor lines
2001
Electromigration-induced stress in aluminum conductor lines measured by x-ray microdiffraction
1998
Reduced electromigration of Cu wires by surface coating
2002
Octagonal washer DC SQUIDs and integrated susceptometers fabricated in a planarized sub- mu m Nb-AlO/sub x/-Nb technology
1993
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
1999
Comparison of Cu electromigration lifetime in Cu interconnects coated with various caps
2003
Electromigration Drift Velocity in Al‐Alloy and Cu‐Alloy Lines
1996
Effect of liner thickness on electromigration lifetime
2003
Electromigration path in Cu thin-film lines
1999
Eiectromigration in Cu/W Structure
1992
Quantitative metrology study of Cu/SiO2 interconnect structures using fluorescence x-ray microscopy
2001
Copper interconnection integration and reliability
1995
Electromigration in On-Chip Single/Dual Damascene Cu Interconnections
2002
Electromigration and stress-induced voiding in fine Al and Al-alloy thin-film lines
1995
Copper interconnections and reliability
1998
In situ scanning electron microscope comparison studies on electromigration of Cu and Cu(Sn) alloys for advanced chip interconnects
1995
Copper Metallization for High Performance Silicon Technology
2000
Stress development in supported polymer films during thermal cycling
1986