Citation Impact
Citing Papers
Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
2006 Standout
Metal-based reactive nanomaterials
2008 Standout
Growth of an intermetallic compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during aging treatment
2003
Interfacial reactions between lead-free solders and common base materials
2005 Standout
Works of Chi-Won Hwang being referenced
Interfacial microstructure between Sn-3Ag-xBi alloy and Cu substrate with or without electrolytic Ni plating
2003
Interface microstructures between Ni-P alloy plating and Sn–Ag–(Cu) lead-free solders
2003