Chieko Kondou

Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management

Review of plate heat exchanger utilized for gases heat exchange

Improving the heat dissipation performance of a looped thermosyphon using low-GWP volatile fluids R1234ze(Z) and R1234ze(E) with a super-hydrophilic boiling surface

Comparative assessment of condensation and pool boiling heat transfer on horizontal plain single tubes for R1234ze(E), R1234ze(Z), and R1233zd(E)