Citation Impact
Citing Papers
Emerging challenges and materials for thermal management of electronics
2014 Standout
Lab-on-a-chip devices: How to close and plug the lab?
2014
Structural Chemistry of Zeolitic Imidazolate Frameworks
2023 StandoutNobel
The Hitchhiker’s Guide to Flow Chemistry
2017 Standout
On the Measurement of Power Law Creep Parameters from Instrumented Indentation
2017
A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems
2011
Works of Bernhard Wunderle being referenced
Forced convective interlayer cooling in vertically integrated packages
2008
Interlayer cooling potential in vertically integrated packages
2008
Nanomechanical characterization of Sn–Ag–Cu/Cu joints—Part 2: Nanoindentation creep and its relationship with uniaxial creep as a function of temperature
2013