Immediate Impact
49 standout
Citing Papers
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Polymer composites with high thermal conductivity: Theory, simulation, structure and interfacial regulation
2024 Standout
Works of Arun Raman being referenced
The material optimization and reliability characterization of an indium-solder thermal interface material for CPU packaging
2006
Author Peers
| Author | Last Decade | Papers | Cites | ||||
|---|---|---|---|---|---|---|---|
| Arun Raman | 70 | 49 | 33 | 57 | 19 | 243 | |
| Longxin Zhang | 129 | 19 | 120 | 12 | 24 | 272 | |
| Fan Wu | 72 | 28 | 62 | 24 | 24 | 228 | |
| Jens Jelitto | 56 | 11 | 48 | 57 | 20 | 205 | |
| Abdullah Algarni | 78 | 10 | 109 | 12 | 29 | 262 | |
| Kenny C. Gross | 103 | 120 | 60 | 42 | 17 | 270 | |
| Jacopo Panerati | 138 | 30 | 40 | 36 | 24 | 293 | |
| Maurício Ferreira Magalhães | 85 | 23 | 21 | 25 | 24 | 172 | |
| Nikhil Tripathi | 180 | 34 | 17 | 25 | 24 | 264 | |
| James P. Black | 97 | 36 | 39 | 6 | 27 | 277 | |
| Lin Jiang | 27 | 10 | 20 | 34 | 31 | 282 |
All Works
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