A.C.K. So

Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb-Sn solder joints reflowed on Au/Ni metallization

Thermal stability of electroless-nickel/solder interface: Part A. interfacial chemistry and microstructure

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Nucleation kinetics of Cu6Sn5 by reaction of molten tin with a copper substrate

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Tin–lead (SnPb) solder reaction in flip chip technology

Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications

Correlation between Ni₃Sn₄ intermetallics and Ni₃P due to solder reaction-assisted crystallization of electroless Ni–P metallization in advanced packages

Interfacial reactions between lead-free solders and common base materials

Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints

Aging studies of Cu-Sn intermetallic compounds in annealed surface mount solder joints

Effect of intermetallic compounds on the shear fatigue of Cu/63Sn-37Pb solder joints

Reliability studies of surface mount solder joints - effect of Cu-Sn intermetallic compounds