Immediate Impact
12 standout
Citing Papers
Comprehensive review and future prospects on chip-scale thermal management: Core of data center’s thermal management
2024 Standout
Flexible Nanocomposite Conductors for Electromagnetic Interference Shielding
2023 Standout
Works of A. Sharma being referenced
3D chip stacking with C4 technology
2008
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
2005
Author Peers
| Author | Last Decade | Papers | Cites | |||||
|---|---|---|---|---|---|---|---|---|
| A. Sharma | 131 | 16 | 1 | 24 | 22 | 5 | 158 | |
| Gerard McVicker | 130 | 12 | 3 | 24 | 13 | 4 | 168 | |
| Shawn A. Adderly | 209 | 54 | 4 | 21 | 8 | 4 | 240 | |
| Dirk Hente | 166 | 13 | 1 | 14 | 27 | 10 | 191 | |
| Joo-Sun Choi | 132 | 12 | 1 | 15 | 8 | 7 | 139 | |
| Arie Nawawi | 164 | 20 | 34 | 32 | 6 | 205 | ||
| Jia Tzer Hsu | 143 | 2 | 37 | 44 | 6 | 189 | ||
| M.B. Kleiner | 109 | 7 | 96 | 4 | 8 | 225 | ||
| M. Berth | 184 | 5 | 10 | 22 | 6 | 206 | ||
| R. Yu | 154 | 16 | 2 | 10 | 2 | 6 | 179 | |
| Panteleimon Papamanolis | 215 | 30 | 39 | 48 | 7 | 250 |
All Works
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