Die Stacking (3D) Microarchitecture

Abstract

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About

This paper, published in 1950, received 450 indexed citations. Written by Bryan Black, Daniel Pantuso, Paul A. Reed, Jeff Rupley, Sadasivan Shankar, John Paul Shen, Clair Webb, Murali Annavaram, J. DeVale and Lei Jiang covering the research area of Electrical and Electronic Engineering. It is primarily cited by scholars working on Electrical and Electronic Engineering (333 citations), Computer Networks and Communications (264 citations) and Hardware and Architecture (242 citations). Published in .

Countries where authors are citing Die Stacking (3D) Microarchitecture

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Citations

This map shows the geographic impact of Die Stacking (3D) Microarchitecture. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Die Stacking (3D) Microarchitecture with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Die Stacking (3D) Microarchitecture more than expected).

Fields of papers citing Die Stacking (3D) Microarchitecture

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Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of Die Stacking (3D) Microarchitecture. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the Die Stacking (3D) Microarchitecture.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

This paper is also available at doi.org/10.1109/micro.2006.18.

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