Yongmin Kwon

521 total citations
34 papers, 366 citations indexed

About

Yongmin Kwon is a scholar working on Electrical and Electronic Engineering, Renewable Energy, Sustainability and the Environment and Materials Chemistry. According to data from OpenAlex, Yongmin Kwon has authored 34 papers receiving a total of 366 indexed citations (citations by other indexed papers that have themselves been cited), including 18 papers in Electrical and Electronic Engineering, 13 papers in Renewable Energy, Sustainability and the Environment and 12 papers in Materials Chemistry. Recurrent topics in Yongmin Kwon's work include Electrocatalysts for Energy Conversion (13 papers), Electronic Packaging and Soldering Technologies (11 papers) and 3D IC and TSV technologies (9 papers). Yongmin Kwon is often cited by papers focused on Electrocatalysts for Energy Conversion (13 papers), Electronic Packaging and Soldering Technologies (11 papers) and 3D IC and TSV technologies (9 papers). Yongmin Kwon collaborates with scholars based in South Korea, United States and Belgium. Yongmin Kwon's co-authors include Sang Woo Han, Jong Wook Hong, Yena Kim, Kyung‐Wook Paik, Yong-Sung Park, Jeong‐Tak Moon, Dae Han Wi, Jaehong Lee, Hye Ryung Byon and Young‐Woo Lee and has published in prestigious journals such as Angewandte Chemie International Edition, Nature Communications and Nano Letters.

In The Last Decade

Yongmin Kwon

29 papers receiving 357 citations

Peers

Countries citing papers authored by Yongmin Kwon

Since Specialization

Citations

This map shows the geographic impact of Yongmin Kwon's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Yongmin Kwon with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Yongmin Kwon more than expected).

Fields of papers citing papers by Yongmin Kwon

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Yongmin Kwon. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Yongmin Kwon. The network helps show where Yongmin Kwon may publish in the future.

Co-authorship network of co-authors of Yongmin Kwon

This figure shows the co-authorship network connecting the top 25 collaborators of Yongmin Kwon. A scholar is included among the top collaborators of Yongmin Kwon based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Yongmin Kwon. Yongmin Kwon is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

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20 of 20 papers shown

#	Title	Journal	Authors	Indexed citations
1	CO Adsorption-Induced Deposition: A Facile and Precise Synthesis Route for Core–Shell Catalysts	ACS Nano	Yongmin Kwon, Kurian A. Kuttiyiel et al.	0
2	Carbon encapsulation dynamics for the solid-state synthesis of high-loading sub-3 nm PtNi alloy electrocatalysts	Journal of Power Sources	Jungmin Han, Eunbi Park et al.	0
3	Effect of palladium core size on the activity and durability of Pt-Monolayer electrocatalysts for oxygen reduction reaction	Applied Surface Science	Eunjik Lee, Yongmin Kwon et al.	3
4	Temperature-dependent carbon shell engineering for highly durable Pt@C catalysts in the oxygen reduction reaction	Applied Surface Science	Eunbi Park, Jungmin Han et al.	3
5	One-Pot Synthesis of Bicontinuous Palladium Nanocubes with Distinct Catalytic Properties for Various Electrocatalysis and Heterogeneous Catalysis	Nano Letters	Yongmin Kwon, Su Bin Choi et al.	2
6	DeepJEB: 3D Deep Learning-Based Synthetic Jet Engine Bracket Dataset	Journal of Mechanical Design	Yongmin Kwon, Namwoo Kang et al.	5
7	Confinement-enabled infusion-alloying of iron into platinum nanoparticle for core-shell PtFe@Pt intermetallic electrocatalyst	Journal of Alloys and Compounds	Changki Kim, Yongmin Kwon et al.	4
8	Directing Energy Flow in Core–Shell Nanostructures for Efficient Plasmon-Enhanced Electrocatalysis	Nano Letters	Yongmin Kwon, Sang Woo Han et al.	27
9	Direct strain correlations at the single-atom level in three-dimensional core-shell interface structures	Nature Communications	Dae Han Wi, Tae-Gu Lee et al.	31
10	Surface Engineering of Palladium Nanocrystals: Decoupling the Activity of Different Surface Sites on Nanocrystal Catalysts	Angewandte Chemie International Edition	Yeji Han, Seunghoon Lee et al.	11
11	Surface Engineering of Palladium Nanocrystals: Decoupling the Activity of Different Surface Sites on Nanocrystal Catalysts	Angewandte Chemie	Yeji Han, Seunghoon Lee et al.	1
12	Characterization of the Proteolytic Activity of a Halophilic Aspergillus reticulatus Strain SK1-1 Isolated from a Solar Saltern	Microorganisms	Dawoon Chung, Nam Seon Kang et al.	12
13	Effects of bending strain and crack direction on crack-based strain sensors	Smart Materials and Structures	Yongmin Kwon, Chan Park et al.	21
14	Enhancing the Activity of Platinum‐Based Nanocrystal Catalysts for Organic Synthesis through Electronic Structure Modification	ChemCatChem	Yena Kim, Yeonjoon Kim et al.	2
15	Studies on the Thermal Cycling Reliability of BGA System-in-Package (SiP) With an Embedded Die	IEEE Transactions on Components Packaging and Manufacturing Technology	Yongmin Kwon, Jinsu Kim et al.	29
16	Content Analysis of Dietary Lifestyle-Related Resreach Articles from 1990 to 2009	Journal of the Korean Home Economics Association	Yongmin Kwon et al.	4
17	Investigation of the Potential Barrier Lowering for Quasi-ballistic Transport in Short Channel MOSFETs	Journal of the Korean Physical Society	Yongmin Kwon, Hyungcheol Shin et al.	1
18	Improvement of drop shock and TC reliability for large die Wafer Level Packages in mobile application		Insoo Kang, Yongmin Kwon et al.	4
19	Effect of Sb addition in Sn-Ag-Cu solder balls on the drop test reliability of BGA packages with electroless nickel immersion gold (ENIG) surface finish		Yong-Sung Park, Yongmin Kwon et al.	9
20	Effect of electoless Ni/Au UBM thickness on mechanical and electromigration relibility of Pb-free solder joints		Yongmin Kwon, Kyung‐Wook Paik	0

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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