Wenhua Yang
- Mechanical Engineering top 10%
- Materials Chemistry
- Electrical and Electronic Engineering
- Aerospace Engineering top 10%
- Mechanics of Materials top 10%
- Co-authors
- Tadatomo SugaHaojun WangWeidong ZengChunling ShiSaifei ZhangMasahisa FujinoWei JiHiroyuki Shintani
- Topics
- 3D IC and TSV technologies (14 papers)Electronic Packaging and Soldering Technologies (12 papers)Copper Interconnects and Reliability (10 papers)
In The Last Decade
Wenhua Yang
29 papers receiving 490 citations
Peers
Comparison fields: 5 of 69
- Mechanical Engineering 220
- Materials Chemistry 187
- Electrical and Electronic Engineering 156
- Aerospace Engineering 154
- Mechanics of Materials 92
Countries citing papers authored by Wenhua Yang
This map shows the geographic impact of Wenhua Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wenhua Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wenhua Yang more than expected).
Fields of papers citing papers by Wenhua Yang
This network shows the impact of papers produced by Wenhua Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wenhua Yang. The network helps show where Wenhua Yang may publish in the future.
Co-authorship network of co-authors of Wenhua Yang
This figure shows the co-authorship network connecting the top 25 collaborators of Wenhua Yang. A scholar is included among the top collaborators of Wenhua Yang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wenhua Yang. Wenhua Yang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.
All Works
| # | Work | Indexed citations |
|---|---|---|
| 1 | 0 | |
| 2 | 1 | |
| 3 | 11 | |
| 4 | 8 | |
| 5 | 7 | |
| 6 | 28 | |
| 7 | 3 | |
| 8 | 3 | |
| 9 | 1 | |
| 10 | 2 | |
| 11 | 23 | |
| 12 | 7 | |
| 13 | 1 | |
| 14 | 6 | |
| 15 | 35 | |
| 16 | 5 | |
| 17 | 136 | |
| 18 | 6 | |
| 19 | 1 | |
| 20 | 34 |
About Wenhua Yang
Wenhua Yang is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering and Automotive Engineering, having authored 30 papers that have together received 500 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and Copper Interconnects and Reliability (10 papers). The work is most often cited by research in Aerospace Engineering (154 citations), Mechanical Engineering (220 citations) and Materials Chemistry (187 citations). Wenhua Yang has collaborated with scholars based in China, Japan and Hong Kong. Frequent co-authors include Tadatomo Suga, Haojun Wang, Weidong Zeng, Chunling Shi, Saifei Zhang, Masahisa Fujino, Wei Ji, Hiroyuki Shintani, Zhaohui Zhou and Zhiqing Zou. Their work appears in journals such as Applied Physics Letters, Journal of The Electrochemical Society and Energy.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.