Wenhua Yang

622 total citations
30 papers, 500 citations indexed

About

Wenhua Yang is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials and Materials Chemistry. According to data from OpenAlex, Wenhua Yang has authored 30 papers receiving a total of 500 indexed citations (citations by other indexed papers that have themselves been cited), including 17 papers in Electrical and Electronic Engineering, 10 papers in Electronic, Optical and Magnetic Materials and 7 papers in Materials Chemistry. Recurrent topics in Wenhua Yang's work include 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and Copper Interconnects and Reliability (10 papers). Wenhua Yang is often cited by papers focused on 3D IC and TSV technologies (14 papers), Electronic Packaging and Soldering Technologies (12 papers) and Copper Interconnects and Reliability (10 papers). Wenhua Yang collaborates with scholars based in China, Japan and Hong Kong. Wenhua Yang's co-authors include Tadatomo Suga, Saifei Zhang, Weidong Zeng, Haojun Wang, Chunling Shi, Masahisa Fujino, Wei Ji, Zhaohui Zhou, Hiroyuki Shintani and Liangliang Zou and has published in prestigious journals such as Applied Physics Letters, Journal of The Electrochemical Society and Energy.

In The Last Decade

Wenhua Yang

29 papers receiving 490 citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Wenhua Yang China 11 220 187 156 154 92 30 500
Tianying Wang China 13 221 1.0× 143 0.8× 98 0.6× 63 0.4× 27 0.3× 38 498
Xinyu Cui China 14 187 0.8× 381 2.0× 87 0.6× 162 1.1× 27 0.3× 51 779
Yongkang Li China 15 349 1.6× 149 0.8× 83 0.5× 114 0.7× 61 0.7× 53 615
Jian Zhong Cui China 10 175 0.8× 216 1.2× 107 0.7× 122 0.8× 37 0.4× 120 498
Hao Dong China 12 137 0.6× 76 0.4× 185 1.2× 25 0.2× 93 1.0× 38 452
Qingqing Zhao China 14 129 0.6× 334 1.8× 164 1.1× 66 0.4× 40 0.4× 39 569
Kuo Zhao China 11 104 0.5× 296 1.6× 98 0.6× 82 0.5× 40 0.4× 46 528
Zeyu Wei China 8 164 0.7× 107 0.6× 197 1.3× 53 0.3× 37 0.4× 15 395
Haoyu Wang China 12 42 0.2× 230 1.2× 85 0.5× 59 0.4× 19 0.2× 43 381

Countries citing papers authored by Wenhua Yang

Since Specialization
Citations

This map shows the geographic impact of Wenhua Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wenhua Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wenhua Yang more than expected).

Fields of papers citing papers by Wenhua Yang

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wenhua Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wenhua Yang. The network helps show where Wenhua Yang may publish in the future.

Co-authorship network of co-authors of Wenhua Yang

This figure shows the co-authorship network connecting the top 25 collaborators of Wenhua Yang. A scholar is included among the top collaborators of Wenhua Yang based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wenhua Yang. Wenhua Yang is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Yang, Wenhua, et al.. (2025). Layered defects effect of Au-ion irradiation in amorphous Al2O3 coating prepared by pulsed magnetron sputtering. Materials Today Communications. 46. 112711–112711. 1 indexed citations
2.
Wang, Xugang, et al.. (2025). Preparation methods, microstructure and properties of Ti-Ta alloys: a review. The International Journal of Advanced Manufacturing Technology. 142(1-2). 39–55.
3.
Yang, Wenhua & Jun Zhou. (2022). Global attractors of the degenerate fractional Kirchhoff wave equation with structural damping or strong damping. Advances in Nonlinear Analysis. 11(1). 993–1029. 7 indexed citations
4.
Yang, Jian, et al.. (2022). A Tripartite Evolutionary Game Analysis of Online Knowledge Sharing Community. Wireless Communications and Mobile Computing. 2022(1). 11 indexed citations
5.
Xie, Chao, Jiyu Xu, Yi Wang, et al.. (2022). Self-Powered Short-Wavelength Infrared Photodetectors Composed of MXene/InGaAs Heterostructures . IEEE Transactions on Electron Devices. 69(11). 6201–6205. 8 indexed citations
6.
Peng, Chang, Wenhua Yang, Wen‐Biao Wu, et al.. (2022). Targeting Glutamine Metabolism Ameliorates Autoimmune Hepatitis via Inhibiting T Cell Activation and Differentiation. Frontiers in Immunology. 13. 880262–880262. 28 indexed citations
7.
Yin, Xiang, Chunyan Wu, Zhenyu Zhang, et al.. (2022). Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer. Microelectronics Reliability. 129. 114483–114483. 3 indexed citations
8.
Yin, Xiang, Wenhua Yang, Chao Xie, et al.. (2021). Plasma-enhanced Si-SiC low-temperature bonding based on graphene composite slurry interlayer. Materials Letters. 293. 129710–129710. 1 indexed citations
9.
Wan, Zhipeng, et al.. (2019). Cellular automaton simulation of dynamic recrystallization behavior in V-10Cr-5Ti alloy under hot deformation conditions. Transactions of Nonferrous Metals Society of China. 29(1). 98–111. 23 indexed citations
10.
Yang, Wenhua, et al.. (2018). Cu film surface reduction through formic acid vapor/solution for 3-D interconnection. 1378–1381. 1 indexed citations
11.
Dong, Yunzhi, Jialin Zhao, Wenhua Yang, et al.. (2018). Adaptive digital noise-cancellation filtering using cross-correlators for continuous-time MASH ADC in 28nm CMOS. 1–4. 6 indexed citations
12.
13.
Suga, Tadatomo, et al.. (2014). Formic acid treatment with Pt catalyst for Cu direct bonding at low temperature. 5. 644–647. 6 indexed citations
14.
Zhang, Saifei, Weidong Zeng, Wenhua Yang, Chunling Shi, & Haojun Wang. (2014). Ageing response of a Al–Cu–Li 2198 alloy. Materials & Design (1980-2015). 63. 368–374. 136 indexed citations
15.
Suga, Tadatomo, et al.. (2014). Formic acid treatment with Pt catalyst for Cu direct and hybrid bonding at low temperature. 5. 1143–1147. 3 indexed citations
16.
Yang, Wenhua, et al.. (2014). Effect of Formic Acid Vapor <italic>In Situ</italic> Treatment Process on Cu Low-Temperature Bonding. IEEE Transactions on Components Packaging and Manufacturing Technology. 4(6). 951–956. 27 indexed citations
17.
Yang, Wenhua, et al.. (2013). A New Combined Process of Formic Acid Pretreatment for Low-temperature Bonding of Copper Electrodes. ECS Transactions. 50(7). 133–138. 5 indexed citations
18.
Yang, Wenhua, et al.. (2012). Formic acid with Pt catalyst combined treatment process for Cu low temperature bonding. 147–150. 3 indexed citations
19.
Yang, Wenhua, et al.. (2012). Low temperature Cu/Cu direct bonding using formic gas in-situ treatment. 12. 79–79. 1 indexed citations
20.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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2026