Wenchao Tian

1.9k total citations
74 papers, 1.5k citations indexed

About

Wenchao Tian is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering and Electronic, Optical and Magnetic Materials. According to data from OpenAlex, Wenchao Tian has authored 74 papers receiving a total of 1.5k indexed citations (citations by other indexed papers that have themselves been cited), including 62 papers in Electrical and Electronic Engineering, 17 papers in Biomedical Engineering and 11 papers in Electronic, Optical and Magnetic Materials. Recurrent topics in Wenchao Tian's work include Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (17 papers) and Advanced MEMS and NEMS Technologies (12 papers). Wenchao Tian is often cited by papers focused on Electronic Packaging and Soldering Technologies (22 papers), 3D IC and TSV technologies (17 papers) and Advanced MEMS and NEMS Technologies (12 papers). Wenchao Tian collaborates with scholars based in China, United States and Australia. Wenchao Tian's co-authors include Linfeng Hu, Zeyi Wu, Le Jiang, Xiaohan Liu, Wenbo Yu, Yingchang Jiang, Cailing Cai, Yanan Wang, Zhichang Pan and Peiyu Yang and has published in prestigious journals such as ACS Nano, Journal of Applied Physics and Advanced Energy Materials.

In The Last Decade

Wenchao Tian

67 papers receiving 1.5k citations

Peers — A (Enhanced Table)

Peers by citation overlap · career bar shows stage (early→late) cites · hero ref

Name h Career Trend Papers Cites
Wenchao Tian China 14 1.2k 491 333 201 176 74 1.5k
Guolin Hou China 22 1.0k 0.9× 524 1.1× 573 1.7× 170 0.8× 250 1.4× 60 1.7k
Yu Han China 16 919 0.8× 332 0.7× 225 0.7× 84 0.4× 327 1.9× 58 1.2k
Hyojin Lee South Korea 18 977 0.8× 356 0.7× 330 1.0× 225 1.1× 203 1.2× 66 1.4k
Zhiqian Chen China 23 1.4k 1.2× 230 0.5× 913 2.7× 139 0.7× 277 1.6× 107 2.3k
Ali Imran China 20 586 0.5× 356 0.7× 624 1.9× 144 0.7× 113 0.6× 56 1.1k
Jang‐Won Kang South Korea 21 587 0.5× 438 0.9× 962 2.9× 209 1.0× 247 1.4× 71 1.4k
Zhimin Liu China 17 1.1k 0.9× 357 0.7× 463 1.4× 254 1.3× 102 0.6× 62 1.4k
Chao Zhao China 22 1.0k 0.9× 159 0.3× 676 2.0× 388 1.9× 85 0.5× 81 1.6k

Countries citing papers authored by Wenchao Tian

Since Specialization
Citations

This map shows the geographic impact of Wenchao Tian's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Wenchao Tian with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Wenchao Tian more than expected).

Fields of papers citing papers by Wenchao Tian

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Wenchao Tian. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Wenchao Tian. The network helps show where Wenchao Tian may publish in the future.

Co-authorship network of co-authors of Wenchao Tian

This figure shows the co-authorship network connecting the top 25 collaborators of Wenchao Tian. A scholar is included among the top collaborators of Wenchao Tian based on the total number of citations received by their joint publications. Widths of edges represent the number of papers authors have co-authored together. Node borders signify the number of papers an author published with Wenchao Tian. Wenchao Tian is excluded from the visualization to improve readability, since they are connected to all nodes in the network.

All Works

20 of 20 papers shown
1.
Zhang, Xin‐Xiang, Yanrong Cao, Chuan Chen, et al.. (2024). Study on Single Event Effects of Enhanced GaN HEMT Devices under Various Conditions. Micromachines. 15(8). 950–950. 5 indexed citations
2.
Li, Haobin, et al.. (2024). Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review. Micromachines. 15(4). 422–422. 10 indexed citations
3.
Tian, Wenchao, Hongyue Wang, Lei Wang, et al.. (2023). High-Frequency Transmission Characteristic Analysis of TSV-RDL Interconnects. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(1). 89–97. 10 indexed citations
4.
Wang, Zhiheng, Yanrong Cao, Xin‐Xiang Zhang, et al.. (2023). Simulation of Single-Event Transient Effect for GaN High-Electron-Mobility Transistor. Micromachines. 14(10). 1948–1948. 6 indexed citations
5.
Tian, Wenchao, Shuaiqi Zhang, Wenbin Li, et al.. (2023). Study on Cavitation, Warpage Deformation, and Moisture Diffusion of Sop-8 Devices during Molding Process. Micromachines. 14(12). 2175–2175. 2 indexed citations
6.
Tian, Wenchao, Hongyue Wang, Xiaowen Zhang, et al.. (2023). Electrothermal Reliability Analysis of Electromigration in 3-D TSV-RDL Interconnects. IEEE Transactions on Components Packaging and Manufacturing Technology. 14(1). 157–165. 3 indexed citations
7.
Xu, Hanyang, Jiabo Huang, Wenchao Tian, & Li Zhao. (2023). Thermal Performance Optimization of Integrated Microchannel Cooling Plate for IGBT Power Module. Micromachines. 14(8). 1498–1498. 10 indexed citations
8.
9.
Tian, Wenchao, et al.. (2023). Research on Surface Morphology of Gold Micro Bumps Based on Monte Carlo Method. Micromachines. 14(7). 1345–1345. 2 indexed citations
10.
Chen, Zhiqiang & Wenchao Tian. (2022). Effect of Surface Roughness on the Electrical Performances of CPW Transmission Lines Used in Future Ultra-High Frequency Applications. Micromachines. 14(1). 104–104. 8 indexed citations
11.
Tian, Wenchao, et al.. (2022). Effect of the reflow process on IMC growth for different devices and complex components. Smart Materials and Structures. 31(11). 115028–115028. 5 indexed citations
12.
Tian, Yi, et al.. (2020). The propagation of the Ion-Flow Near the AC Transmission Lines. IEEE Access. 8. 146498–146509. 2 indexed citations
13.
Wu, Zeyi, Yanan Wang, Lin Zhang, et al.. (2020). A Layered Zn0.4VOPO4·0.8H2O Cathode for Robust and Stable Zn Ion Storage. ACS Applied Energy Materials. 3(4). 3919–3927. 76 indexed citations
14.
Wu, Zeyi, Chengjie Lu, Yanan Wang, et al.. (2020). Ultrathin VSe2 Nanosheets with Fast Ion Diffusion and Robust Structural Stability for Rechargeable Zinc‐Ion Battery Cathode. Small. 16(35). e2000698–e2000698. 225 indexed citations
15.
Tian, Wenchao, et al.. (2020). Research status of wafer level packaging for RF MEMS switches. 1–5. 4 indexed citations
16.
Tian, Wenchao, et al.. (2019). Analysis and Experimental Test of Electrical Characteristics on Bonding Wire. Electronics. 8(3). 365–365. 15 indexed citations
17.
Jiang, Le, Zeyi Wu, Yanan Wang, et al.. (2019). Ultrafast Zinc-Ion Diffusion Ability Observed in 6.0-Nanometer Spinel Nanodots. ACS Nano. 13(9). 10376–10385. 152 indexed citations
18.
Wang, Yanan, Zeyi Wu, Le Jiang, et al.. (2019). A long-lifespan, flexible zinc-ion secondary battery using a paper-like cathode from single-atomic layer MnO2 nanosheets. Nanoscale Advances. 1(11). 4365–4372. 43 indexed citations
19.
Tian, Wenchao, Xiaohan Liu, & Wenbo Yu. (2018). Research Progress of Gas Sensor Based on Graphene and Its Derivatives: A Review. Applied Sciences. 8(7). 1118–1118. 185 indexed citations
20.
Jiang, Yingchang, Zeyi Wu, Le Jiang, et al.. (2018). Freestanding CoSeO3·H2O nanoribbon/carbon nanotube composite paper for 2.4 V high-voltage, flexible, solid-state supercapacitors. Nanoscale. 10(25). 12003–12010. 57 indexed citations

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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